News Archive

OpenLight Tower Show 400G Photonic Chip

OpenLight Tower Show 400G Photonic Chip

OpenLight Photonics, a leading photonic chip designer, has recently unveiled a groundbreaking 400G/lane modulator on the integrated silicon photonics platform at Tower Semiconductor. The impressive achievement was made possible through the utilization of the PH18DA process, enabling the design to surpass a...

Published on: March 13, 2025

48V Hot Swap Controller for AI Servers

48V Hot Swap Controller for AI Servers

Infineon Technologies has introduced a cutting-edge 48 V wide input voltage range digital hot swap controller, the XDP711-001, specifically designed for high-power AI servers. This innovative controller features a programmable safe operating area (SOA) control, providing enhanced safety and efficiency in server...

Published on: March 13, 2025

Fifth quantum-secure encryption algorithm selected

Fifth quantum-secure encryption algorithm selected

The US National Institute of Standards and Technology (NIST) has selected a new algorithm for post-quantum encryption. The HQC algorithm is designed to act as a backup for ML-KEM, the primary algorithm for general encryption with key encapsulation. HQC utilizes a different...

Published on: March 13, 2025

congatec showcases heatpipe cooling for COM module

congatec showcases heatpipe cooling for COM module

German board maker congatec has unveiled a new heatpipe cooling system designed for Computer-on-Module (COMs) at Embedded World in Nuremberg. This innovative system utilizes acetone as a working fluid in the heat pipes, offering several advantages over traditional water-based systems. By using...

Published on: March 13, 2025

Infineon to Introduce 12kW Battery Backup for Data Centers

Infineon to Introduce 12kW Battery Backup for Data Centers

Infineon Technologies is making strides in the tech industry by developing the industry’s first 12kW battery backup unit (BBU) specifically designed for AI data centres. This innovative solution comes in response to the increasing power demands of the next generation of AI...

Published on: March 12, 2025

OPmobility partners with Siemens for digital production backbone

OPmobility partners with Siemens for digital production backbone

OPmobility in France has made a significant move by adopting Teamcenter X, the cloud-enabled Product Lifecycle Management (PLM) software from Siemens, for its automotive systems. Formerly known as Plastic Omnium, OPmobility aims to leverage Teamcenter as its central platform to streamline workflows,...

Published on: March 12, 2025

2025 Automotive Report Focuses on Code Quality, AI, and Safety

2025 Automotive Report Focuses on Code Quality, AI, and Safety

The automotive software development landscape is evolving rapidly, with a recent survey highlighting key trends in the industry. According to the 2025 State of Automotive Software Development Report from Perforce, there is a noticeable shift towards prioritizing safety in conjunction with the...

Published on: March 12, 2025

QuamCore Secures €9m for Quantum Age Digital Logic

QuamCore Secures €9m for Quantum Age Digital Logic

QuamCore in Israel has emerged from stealth with €9m funding for a new type of digital logic for building quantum computers with 1m qubits. Rather than using CMOS, QuamCom is using superconducting flux loops to provide digital logic with a new architecture...

Published on: March 12, 2025

TSMC dominates foundry market

TSMC dominates foundry market

TSMC solidified its position as a dominant player in the global pure-play foundry market, capturing a commanding 67.1 percent share in the fourth quarter of 2024, as reported by TrendForce. This marked a significant increase of 2.4 percentage points for TSMC, further...

Published on: March 12, 2025

Irresistible Materials for Next Generation 1nm EUV

Irresistible Materials for Next Generation 1nm EUV

Imec and ASML have recently extended their collaboration to tackle the challenges associated with the next generation of extreme ultraviolet (EUV) technology. The development of materials to complement the multimillion-dollar EUV machines for the production of next-generation 1nm chips poses a significant...

Published on: March 12, 2025

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