Triad Launches Aerospace and Defence Mixed-Signal IC Division

Triad Semiconductor has recently announced the establishment of Triad Micro Devices (TMD), a new division dedicated to the development of analogue and mixed-signal integrated circuits for aerospace and defense applications. TMD aims to become a leading center for high-performance and high-reliability IC development in this industry.

TMD's Chief Technology Officer, Jim Kemerling, stated, "Having been involved in the aerospace and defense sector for many years, Triad is taking a strategic leap forward by creating TMD. With our expertise in analogue and mixed-signal IC design, as well as our proprietary design tools and patented technology, we are well-positioned to meet the demands of this market."

One of the key technologies developed by TMD is a metal-via configurable structured ASIC. This ASIC, which consists of pre-established circuit blocks in the semiconductor layers, can be radiation-qualified to MIL-PRF-38535. The company claims that its fabric allows for configurability from transistor-level device primitives to top-level interconnect using a single mask layer.

TMD believes that its metal-configurable approach offers several advantages in terms of cost, development time, and qualification. However, the company also acknowledges that a full-custom solution may sometimes be the best fit. In order to address the end-of-life issue, TMD guarantees the availability of its solutions for up to 25 years, aligning with the lifespan of defense systems.

Triad Micro Devices is headquartered in Winston-Salem, North Carolina, sharing the same location as Triad Semiconductor. While TMD focuses on aerospace and defense applications, Triad Semiconductor will continue to develop ASICs for consumer medical and communications sectors.