Ansys Collaborates with Nvidia Omniverse for Advanced 3D Multiphysics Visualization

Ansys, a leading engineering simulation software company, has recently announced its collaboration with Nvidia Omniverse to revolutionize the visualization capabilities of its physics solver for 3D IC designers. This partnership aims to provide real-time and accurate visualizations of electromagnetic (EM) and thermal package effects for 3D IC designs in cutting-edge technologies such as 5G/6G, Internet of Things (IoT), artificial intelligence (AI)/machine learning (ML), cloud computing, and autonomous vehicles.

The shift towards 3D vertically stacked chips has significantly reduced the form factor of electronic devices. However, this design approach poses challenges related to electromagnetic interference and thermal stress effects. Understanding and tracing the origins of these complex issues have become more critical than ever. To address these challenges and enable more advanced applications, the integration of 3D multiphysics visualization has become a necessity for effective design and diagnostics.

Ansys has successfully integrated the Omniverse APIs to develop OpenUSD- and Nvidia RTX-enabled 3D applications and workflows. This integration allows for real-time 3D-IC visualization of results generated by Ansys solvers, including popular tools like HFSS, Icepak, and RedHawk-SC. Designers can now interact with 3D models to assess critical phenomena related to electromagnetic fields and temperature variations with unprecedented clarity and accuracy.

"Advanced manufacturing relies on marrying the physical world with the digital," stated Prith Banerjee, the chief technology officer at Ansys. "By leveraging the Nvidia Omniverse platform, Ansys is at the forefront of comprehensive simulation and design, ranging from tiny semiconductors to the vast factories where they are manufactured. The integration of Ansys tools like RedHawk-SC with Omniverse opens up new possibilities for visualization and design capabilities."

In a significant development, RedHawk-SC, a key tool in Ansys' semiconductor solutions, is now powered by Nvidia's Grace CPU Superchips. This enhancement has resulted in improved performance for multiphysics designs, further solidifying Ansys' position as a leader in engineering simulation software. Rev Lebaredian, the vice president of Omniverse and simulation technology at Nvidia, emphasized the impact of accelerated computing, AI physics, and physically based visualization in driving the next wave of industrial digitalization. The integration of Ansys semiconductor solutions with Omniverse Cloud APIs is expected to streamline the design and engineering processes within the electronics ecosystem.

The groundbreaking 3D-IC multiphysics visualization capabilities enabled by Omniverse will be showcased at the upcoming DAC conference in San Francisco, offering industry professionals a glimpse into the future of 3D IC design and simulation.

For more information, visit www.ansys.com.