Cutting-Edge 5nm DSP Powers Terabit AI Infrastructure

Broadcom has introduced a cutting-edge 200Gbit/s DSP PHY designed for terabit AI data center architectures, utilizing a state-of-the-art 5nm process. The newly launched 5nm Broadcom Sian2 DSP PHY is capable of delivering 200 Gbit/s per lane (200G/lane) through PAM-4 modulation, specifically tailored for pluggable modules in the next generation of AI clusters.

The demand for enhanced AI cluster sizes and performance capabilities is rapidly increasing to accommodate the expanding AI model sizes. To support the scale-up and scale-out of next-generation AI clusters, high performance, low latency, and robust connectivity are essential requirements.

As the industry moves towards more power-efficient and cost-effective solutions, there is a noticeable shift from the current 400G/800G links with 100G/lane optics in AI clusters to 800G/1.6T links with 200G/lane optics enabled by the Sian2 technology. The Sian2 and Sian DSPs are optimized for 800G and 1.6T optical module platforms, offering double the bandwidth with a 28W power envelope, reduced latency, and lower cost per bit.

The combination of Sian2 and Sian PHY, along with Broadcom's advanced 200G/lane optics such as electro-absorption modulated laser (EML) and continuous wave laser (CWL), delivers superior performance and power efficiency. This empowers data center operators to efficiently scale AI workloads while maintaining cost-effectiveness.

"200G/lane DSP serves as the foundation for high-speed optical links in the next generation of scale-up and scale-out networks within the AI infrastructure," stated Vijay Janapaty, Vice President and General Manager of the Physical Layer Products Division at Broadcom. "The Sian product line reinforces Broadcom's leadership in optical DSP PHYs, enabling our AI data center customers to deploy high-performance 800G and 1.6T links."

According to Dr. Vlad Kozlov, CEO and Chief Analyst at LightCounting, leading AI market players are expected to begin adopting optical modules utilizing 200G/lane by 2025. The intense competition in the AI sector is driving a surge in demand, with projections indicating over 1 million units of 1.6T optical transceivers within the initial 12 months of deployment.

The 5nm 200G/lane DSP devices are instrumental in enabling sub-28W 1.6T transceivers and supporting 800G and 1.6T pluggable modules, catering to both 212.5-Gb/s and 226.875-Gb/s data rates for InfiniBand and Ethernet applications. These devices offer various forward error correction (FEC) options, including Bypass, Segmented, and Concatenated FEC, as well as built-in low-swing and high-swing laser drivers for SiP and EML based optical modules, ensuring latency under 80ns for AI/ML applications.

Richard Huang, CEO of Eoptolink Technology, highlighted the significance of Sian2 in facilitating the design of high-speed optical transceivers for next-generation switches, network interface cards, and accelerators with 200G SerDes interfaces. The collaboration between Broadcom's Sian2 DSP and Eoptolink's innovative transceiver design approach results in leading performance 1.6T pluggable optical transceivers, meeting the escalating bandwidth demands in AI networks.

InnoLight Technology, a key player in the industry's transition to 1.6T with energy-efficient transceiver solutions, is leveraging Broadcom's Sian2 DSP to drive this evolution. Hai Ding, VP of Marketing at InnoLight Technology, emphasized their commitment to redefining optical networking through cutting-edge innovations, accelerating the deployment of 200G/lane pluggables for next-generation AI workloads.

The Sian2 PHY and 200G/lane optics integrated within 1.6T DR8 optical modules will be showcased at the Innolight Booth B81 and Eoptolink Booth D60 during the ECOC Exhibition 2024 in Frankfurt, Germany this week. Broadcom is currently offering samples of the Sian2 BCM8582X device to its early access customers and partners, paving the way for the future of high-speed optical networking.

For more information, visit www.broadcom.com.