EU project aims for space imaging sensing breakthrough

A consortium financed by the European Union (EU) is spearheading the development of cutting-edge high-resolution image sensors for potential use in a variety of space missions, ranging from Earth observation to planetary exploration and scientific research. The three-year Technology for European iNdependence in Space Image Sensor (TENSIS) project is dedicated to advancing CMOS imaging sensors within the EU, with the goal of establishing a strategic competitive edge for European prime contractors and equipment manufacturers while reducing dependence on critical technologies from external sources.

The project was officially launched on 11 February 2025 at the Teledyne e2v facilities in Saint-Egrève, Grenoble Area, France. The primary objective of TENSIS is to validate a scalable, large-area, high-resolution, radiation-tolerant, customizable, and cost-effective 180nm CMOS detector. This detector will boast impressive technical specifications, including a 24K x 16K stitched CMOS matrix comprising 400 MPixels. Additionally, a smaller 4K x 4K stitched CMOS array will also be developed and manufactured as part of the project.

Comprised of several key industrial partners, each contributing unique expertise, the TENSIS project is set to make significant strides in the field of advanced image sensor technology. Teledyne e2v Semiconductors SAS (France) and Teledyne Innovaciones Microelectronicas SL (Spain) will take charge of overseeing the project and designing the detectors, including the pixel. Meanwhile, imec (Belgium) will be responsible for managing the development of the optical stack on top of the CMOS detector, which includes filters and optical microlenses.

Leading the development of test equipment and evaluating the performance of the detector prototypes is Airbus Defence and Space SAS (France). Additionally, Alter Technology Tüv Nord (Spain) will be tasked with validating the smaller 4K x 4K detector for its suitability in a space environment. The collaborative efforts of these industrial partners are crucial in ensuring the success and effectiveness of the TENSIS project.

According to Marc Iliozer, Project & Engineering Director at Teledyne e2v, "TENSIS will pave the way for the creation of advanced image sensors designed for space applications that are not only high-resolution but also resilient in the face of challenging space conditions. This project is instrumental in establishing strategic capabilities in Europe and securing independence in space technology for the foreseeable future." The TENSIS project is scheduled to continue until 31 December 2027, with the 24K x 16K stitched CMOS array expected to achieve Technology Readiness Level (TRL) 6, featuring a prototype sensor that has been rigorously tested in a relevant environment. Simultaneously, the 4K x 4K CMOS detector is projected to reach TRL7, bringing it one step closer to final product development.