CSA Catapult teams for 9m Scottish power packaging line

The National Manufacturing Institute Scotland (NMIS) is embarking on an exciting new venture by establishing a pilot line for power semiconductor advanced packaging, utilizing cutting-edge technology from the Compound Semiconductor Applications (CSA) Catapult in Wales. Situated in Inchinnan, Renfrewshire, this initiative forms part of the University of Strathclyde’s Advanced Net Zero Innovation Centre (ANZIC) and has received substantial backing of £9m (€11m) from Innovate UK. Scheduled to commence operations later this year, the pilot line represents a significant step forward in the realm of semiconductor packaging.

Building upon a previous investment of £1.6m in a power packaging R&D line at the CSA Catapult headquarters in Newport, Wales, the new pilot line will incorporate innovative technologies such as multi-material 3D printing for rapid prototyping of novel packages using ceramic and mixed materials. Additionally, the facility will feature a 3D metal printer capable of creating fast prototypes for embedded packages and modules using conductive materials like copper. An optimised laser system will also be employed for dicing semiconductors and processing ceramic or metal materials to facilitate the development of novel package designs.

Notably, Custom Interconnect Ltd (CIL) in Andover, UK boasts a state-of-the-art 15,000sq ft ISO7 Class 10,000 cleanroom dedicated to power device packaging. The facility offers a range of services including wafer dicing, die attach, wire bonding, power device copper clip attach, glob top, and full plastic overmold or potting. This underscores the growing emphasis on enhancing semiconductor packaging capabilities within the UK.

The Scottish pilot line is poised to collaborate closely with the CSA Catapult, as highlighted by Professor Matt Boyle, Director of Electrification at NMIS. By providing scale-up capabilities for power devices, the pilot line aims to significantly reduce packaging times for UK firms, streamlining the production process from months to mere days. This strategic partnership underscores a concerted effort to bolster the UK’s semiconductor industry and foster innovation in packaging technologies.

In light of global materials shortages, limited manufacturing capacity, and a dearth of innovation facilities, the UK supply chain has faced challenges in sourcing key components domestically, leading to prolonged delays. The NMIS scale-up packaging line seeks to address these critical production gaps by supporting UK companies in developing new technologies and promoting the use of domestically manufactured wafers. This initiative is poised to revolutionize semiconductor manufacturing in the UK and position the country as a leader in sector innovation.