SolidRun has recently introduced the HoneyComb Ryzen V3000 development platform, a cutting-edge Mini-ITX board that, when paired with the Ryzen Embedded V3000 COM Express 7 (CEX7) module, offers outstanding performance, reliability, and flexibility for accelerating time to market in industrial, networking, and edge computing applications.
The HoneyComb Ryzen V3000 development platform allows customers to easily assess, test, and prototype with SolidRun’s established AMD Ryzen V3000 COM Express 7 modules in real-world scenarios. It provides a wide range of carrier board customization options to meet specific application needs, empowering developers to swiftly iterate and adjust their designs. Notable features include advanced power efficiency for optimizing performance-per-watt, dual 10Gb Ethernet ports for high-speed, dependable network connectivity, and exposed PCIe lanes supporting various accelerators and expansion options crucial for enhancing functionality and performance.
The AMD Ryzen V3000 CEX7 module houses the AMD Ryzen Embedded 8-core V3C18I processor clocked at 1.9 GHz (base) and up to 3.8 GHz (boost), along with 64GB DDR5 memory. The HoneyComb Ryzen V3000 Mini-ITX development platform comes with fast and reliable PCIe Gen 4 NVMe storage, delivering exceptional computing power and performance in an ultra-compact form factor. Engineered to endure extreme conditions, this system features a powered CPU cooler enabling operation in environments ranging from -40°C to 85°C and can be configured to run at 15 to 45 W.
“Our HoneyComb Ryzen V3000 offers remarkable flexibility, allowing customers to create, test, and deploy high-performance embedded systems tailored to their specific requirements,” stated Jon Nettleton, Chief System Architect at SolidRun. “With dual 10Gb Ethernet, extensive PCIe expansion, and exceptional power efficiency, this platform is ideally suited for demanding edge applications, from AI acceleration to software-defined networking and beyond.”
SolidRun’s HoneyComb Ryzen V3000 development platform is currently available and is supported by long-term embedded lifecycle support to ensure reliability for enterprise and industrial deployments.