AI Chiplets Boosted by Glass Substrate Alliance

An alliance of companies is aiming to boost the use of glass substrates for more complex AI chips and chiplets.

The E-Core Alliance, led by E&R Engineering in Taiwan, has brought together over 15 companies to accelerate the development of large glass substrates. With the increasing demand for AI chips, high-frequency, and high-speed communication devices, the importance of glass substrates in advanced packaging technologies is on the rise. Glass substrates offer higher wiring density and better signal performance compared to traditional copper foil substrates. Moreover, glass provides high flatness and can withstand high temperatures and voltages, making it an ideal alternative.

Intel and other tech giants have been exploring the use of glass substrates for chiplet packaging, with the US government's CHIPS Act funding further driving the development of glass substrates. These glass substrates, measuring 515×510mm, require glass metallization, ABF lamination, and final substrate cutting. Key processes in glass metallization include TGV (Through-Glass Via), wet etching, AOI (Automated Optical Inspection), sputtering, and plating.

The E-Core Alliance boasts a lineup of industry leaders such as Manz AG and Scientech for wet etching, ShyaWei Optronics for AOI optical inspection, and Lincotec, STK, Skytech, and Group Up for sputtering and ABF lamination equipment. Other key component suppliers like HIWIN, HIWIN Mikrosystem, Keyence Taiwan, Mirle Group, ACE PILLAR, CHD TECH, and Coherent are also part of the alliance.

One of the critical aspects of glass substrate technology is the glass laser modification (TGV) process. While this technology has been around for over a decade, its speed previously fell short of mass production requirements, achieving only 10 to 50 vias per second. The E-Core Alliance aims to enhance glass substrate technology by combining expertise, providing cutting-edge equipment and materials, and catering to both domestic and international customers.

The Through-Glass Via (TGV) in the Glass Core Flow developed by E&R has significantly improved the speed of the process, achieving up to 8,000 vias per second for matrix layouts or 600 to 1,000 vias per second for random layouts on a glass substrate. E&R is committed to leading the development of glass substrate technology in Taiwan, optimizing processes, and fostering collaborations with more industry partners to drive innovation and excellence.

E&R has collaborated with a North American IDM customer for the past five years to refine glass laser modification TGV technology. Last year, the process successfully passed validation, with E&R achieving a remarkable accuracy of +/- 5 μm, meeting the 3 sigma standard. This breakthrough has paved the way for glass substrates to enter mass production, marking a significant milestone in the advancement of AI chip development.

For more information, visit E&R Engineering.