ASE Demonstrates Vertical Power in AI Data Centers

Advanced Semiconductor Engineering (ASE), a leading packaging giant, has introduced a groundbreaking system in package technology aimed at enhancing power efficiency in AI and data center applications.

The innovative ASE powerSiP technology is designed to minimize signal and transmission loss while effectively managing current density through a vertically integrated multi-stage voltage regulator module (VRM). This approach results in higher system efficiency and reduced power consumption.

Compared to traditional side-by-side configurations, the vertical powerSiP is 25% smaller, enabling a remarkable 50% increase in current density from 0.4A/mm² to 0.6A/mm². Additionally, routing power loss is significantly decreased from 12% to 6%, showcasing the technology's superior performance.

Infineon, a key player in the industry, is also exploring advancements in power modules for AI applications, aiming for a remarkable 2000A capacity.

As data centers evolve, the efficiency of power delivery networks (PDNs) becomes crucial. While individual power conversion stages exhibit high efficiency in the mid to high 90% range, routing losses can become a bottleneck at higher power levels. This is particularly evident in the path from the final DC-to-DC converter to the microprocessor.

Traditionally, systems have relied on a single-stage voltage reduction approach, delivering power to the microprocessor at a higher voltage using the VRM. The introduction of the powerSiP platform opens up possibilities for a multi-stage VRM-based PDN solution, enhancing overall system efficiency.

The International Energy Agency (IEA) reports a significant surge in energy consumption by data centers, reaching 460 terawatt-hours (TWh) in 2022, equivalent to 2% of global electricity usage. By 2026, this figure is projected to double to 1,000 TWh, representing 8% of global electricity consumption.

This escalating energy demand is primarily driven by the widespread adoption of AI technologies and the increasing reliance on CPU, GPU, memory, and disk systems. The rising costs associated with power conversion and cooling inefficiencies underscore the urgent need for innovative solutions.

YE Yeh, Vice President of Research & Development at ASE, emphasizes the benefits of the powerSiP platform, stating, “Placing the voltage regulator directly beneath the SoC and chiplets, along with vertical integration, enables a robust current supply with a short power delivery path. This effectively reduces impedance in the power delivery network, enhancing system performance, functionality, and overall efficiency.”

The ASE powerSiP technology is currently available and will continue to evolve in line with industry trends and application demands, offering a promising solution to the challenges of power efficiency in AI and data center environments.

For more information, visit www.ase.aseglobal.com.