The first major parts of ASML's highly anticipated high-NA EUV machine have been successfully delivered to Intel's Oregon development fab. This significant milestone marks a crucial step forward in the partnership between the two tech giants. ASML, a leading manufacturer of advanced lithography systems, expressed their excitement and pride in a recent Twitter post.
Intel CEO Pat Gelsinger, who took over the reins in 2021, played a pivotal role in securing the rights to the initial deliveries of ASML's latest EUV lithography machine. Gelsinger's commitment to restoring Intel's position as an industry leader in process technology was a driving force behind this strategic move.
The high-NA machine, with a staggering price tag of $275 million, is set to revolutionize Intel's production capabilities. The company plans to utilize this cutting-edge technology in 2025, coinciding with their ambitious goal of reclaiming industry technology leadership through their 18A process.
It is worth noting that Intel has been at the forefront of EUV technology development for decades. As early as 1997, the company's co-founder, CEO, and chairman recognized the immense potential of EUV and initiated a consortium with the US National Laboratories to transform this concept into a reality. At the time, Intel's visionary leader, Gordon Moore, emphasized the need to push the boundaries of optics manufacturing to achieve what was then considered nearly impossible.
With the delivery of ASML's high-NA EUV machine, Intel is poised to make significant strides in advancing semiconductor manufacturing. This state-of-the-art technology will undoubtedly play a crucial role in Intel's pursuit of process leadership and innovation in the years to come.