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BAe Systems partners with NEXT Semi for space antenna processor

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April 30, 2025

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BAe Systems has announced a partnership with US startup NEXT Semiconductor Technologies to incorporate ultra-wideband antenna processor units (APUs) in their satellite communications designs. These radiation-hardened APUs offer advanced signal acquisition and generation capabilities along with high-reliability, reconfigurable digital processing, making them ideal for next-generation satellite sensors and transmitters.

The NX450 APU, specifically, boasts an impressive 100GHz of instantaneous RF bandwidth spread across four independent receive and transmit channels. This innovative design streamlines sensor development by bringing signal digitization and processing closer to the edge, enabling a software-defined radio architecture that reduces size, weight, and power requirements while ensuring embedded application processor redundancy for enhanced reliability.

Furthermore, the APU is produced using an onshore GlobalFoundries 12LP 12nm FinFET process and is packaged in a compact 11x23mm BGA format, perfect for secure wide-bandwidth satellite communication (SATCOM) applications.

As Mike Kappes, President and Chief Strategy Officer at NEXT Semiconductor, highlighted, "NEXT is deeply involved in the advancement of high-reliability, software-defined SoC solutions tailored for next-generation satellite payloads. We are excited to collaborate with BAE Systems to address upcoming space missions utilizing our unique SoC capabilities." NEXT Semiconductor, established in 2023 in San Diego by industry veterans from Broadcom, Qualcomm, and IQ Analog, brings a wealth of expertise to the table.

BAE Systems will offer support for the NX450 APU in low Earth orbit (LEO) satellites and aims to integrate its own application-specific integrated circuit (ASIC) technology and knowledge in future projects. Jim LaRosa, Space Systems program director at BAE Systems, emphasized, "Drawing on our extensive experience in space electronics, we can apply our radiation-hardened techniques to a commercial off-the-shelf product, delivering a new capability to meet the needs of our space customers. Our collaboration with NEXT paves the way for future solutions with significantly enhanced mission and environmental performance."

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