Black Semi Unveils Timetable for Graphene Optical Chip Production

Black Semiconductor GmbH Plans to Produce Graphene-Based Optical Communications Chips

Black Semiconductor GmbH, based in Aachen, Germany, has announced its ambitious plans to start producing optical communications chips based on graphene at a pilot line by 2027. The company aims to gradually transition to volume production in the following years, marking a significant milestone in the field of semiconductor technology.

The German federal government and the State of North-Rhine-Westphalia have shown their confidence in the potential of Black Semiconductor by pledging a substantial amount of funding. With a commitment of €228.7 million, the government support underscores the importance of advancing innovative technologies in the region.

Black Semiconductor is touting its cutting-edge technology that enables the integration of photonics and electronics using graphene devices. This breakthrough allows for the conversion of electronic signals into optical signals and vice versa, opening up a wide range of applications in various industries such as high-performance computing, AI data centers, autonomous vehicles, and robotics.

The company's unique 'back-end-of-line' photonics manufacturing process facilitates on-chip optical signal routing and fiber-to-chip interfaces for seamless chip-to-chip connections. Black Semiconductor claims that its technology supports bidirectional electro-optic conversion with the potential for data transmission rates of up to 10Pbits/s, showcasing its high-performance capabilities. Moreover, the technology is designed to be compatible with CMOS 'front-end of line' manufacturing, ensuring a smooth integration process.

In a recent development, Black Semiconductor has relocated to its new headquarters and manufacturing site, FabONE, spanning an impressive 17,000 square meters. The company has outlined a detailed timeline for its production milestones, starting with the construction of a scalable pilot line for 300mm wafer technology in 2025. By 2026, the pilot line is expected to become operational, paving the way for pilot production to commence in 2027 with a focus on optimizing manufacturing processes. The company aims to achieve full volume production by 2031, marking a significant step towards commercialization.

• 2025: Start construction of a scalable pilot line for 300mm wafer technology.
• 2026: Operationalization of the pilot line.
• 2027: Commencement of pilot production to optimize manufacturing processes.
• 2029: Transition to volume production, with full volume production targeted for 2031.
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With a state-of-the-art facility at FabONE, encompassing 15,000 square meters for cleanroom and manufacturing infrastructures along with 2,000 square meters of office space, Black Semiconductor is well-equipped to drive innovation in the semiconductor industry. The company currently employs 50 individuals at FabONE, with plans to expand its workforce to 100 employees by the end of 2025, signaling a promising growth trajectory for the company.