Canon Unveils Cutting-Edge 5nm Nano-Imprint Lithography Machine

Canon, a prominent volume producer of KrF and i-line optical lithography machines, is making significant strides in the field of nano-imprint lithography (NIL). This technology is gaining attention as a potential alternative to the costly leading-edge extreme ultra-violet (EUV) lithography. By offering a more cost-effective solution, NIL has the potential to revolutionize the semiconductor industry.

A NIL system operates by defining chips through the process of stamping out photoresist patterns. Canon's FPA-1200NZ2C NIL system, designed for 300mm wafers, allows for precise patterning with a minimum linewidth of 14nm. This is roughly equivalent to the capabilities of the 5nm manufacturing node. Canon envisions further advancements in mask technology that could push NIL to achieve a minimum linewidth of 10nm, corresponding to the 2nm node.

One of the key advantages of NIL is its ability to faithfully reproduce fine circuit patterns on the wafer without the need for optical pattern correction (OPC). This eliminates the complexity and computational intensity associated with traditional optical mechanisms. As the industry increasingly explores AI techniques for pattern correction, NIL emerges as a streamlined and efficient solution for semiconductor manufacturing.

Canon has announced plans to potentially ship nano-imprint lithography machines as early as 2024. The company's FPA-1200NZ2C system is set to be deployed at the Texas Institute for Electronics, where it will support research and development efforts focused on advanced semiconductors and the production of prototypes. This collaboration underscores Canon's commitment to driving innovation in semiconductor technology.

The Texas Institute for Electronics, established in 2021 with support from The University of Texas at Austin, serves as a semiconductor consortium that brings together various stakeholders including state and local governments, semiconductor companies, and national research institutions. By providing open access to research initiatives and prototyping facilities, the institute aims to address challenges related to advanced semiconductor technology, including advancements in packaging technology.