CEA-Leti Unveils €830m FAMES Pilot Line Project

CEA-Leti, a leading research institute in France, has recently initiated an €830 million pilot line dedicated to advancing next-generation process technologies. Known as the FAMES Pilot Line, this ambitious project aims to develop and implement five innovative sets of technologies, ranging from 10nm and 7nm FD-SOI to embedded non-volatile memories and small inductors for DC-DC converters in Power Management Integrated Circuits (PMIC).

The FAMES pilot line is set to support a wide array of cutting-edge technologies, including OxRAM, FeRAM, and MRAM embedded memories, as well as two 3D integration options: heterogeneous integration and sequential integration. Additionally, the pilot line will cater to RF components such as switches, filters, and capacitors, showcasing its versatility and potential impact on various industries.

Backed by the EU Chips Joint Undertaking, the FAMES pilot line has garnered support from 43 companies across the electronic-systems value chain. These stakeholders include materials providers, equipment manufacturers, fabless companies, EDAs, IDMs, and system houses, all of whom are eager to leverage the capabilities of the pilot line. Located in Grenoble, France, the facility is expected to attract end-users from diverse sectors, including IT, automotive, medical devices, space, and security markets.

The FAMES consortium, spearheaded by Leti in collaboration with prominent research institutions and organizations across Europe, is poised to revolutionize the semiconductor industry. Partners such as imec, Fraunhofer Mikroelektronik, and Silicon Austria Labs are working together to drive innovation and create new market opportunities. The five new technologies developed through the FAMES Pilot Line are projected to enable advancements in low-power microcontrollers, AI devices, RF components, automotive chips, smart sensors, and more.

“By integrating cutting-edge technologies, the FAMES Pilot Line will pave the way for disruptive system-on-chip architectures, offering smarter and more efficient solutions for future chips. Sustainability is a key focus of the project, addressing semiconductor sustainability challenges,” stated Jean-René Lèquepeys, CTO of CEA-Leti. The collaboration between European actors in this initiative underscores the commitment to technological advancement and sustainability in the semiconductor industry.