Chiplet Paradigm Boosted at Technical Conference

At the highly anticipated ECTC 2024 conference in Denver, Colorado, from May 28 to 31, IBM researchers are set to unveil groundbreaking advancements in computer technology. Among the highlights is a cutting-edge computer system that boasts a 32-bit processor, memory, analog I/O, built-in sensors for temperature and chemicals, an energy-harvesting power source, and sophisticated operating system software.

IBM will also showcase a revolutionary high-throughput chiplet packaging process designed for military, commercial, and consumer applications. This innovative process enables the creation of sensor data acquisition and secure communications components on a substrate that is less than 1 square millimeter in size. By incorporating wafer-to-wafer (W2W) transfer and integrated optical photovoltaic/photodiode cells, IBM is pushing the boundaries of miniaturization and efficiency in computer system design.

The 74th edition of the conference coincides with a surge in interest in multi-die packaging and chiplet manufacturing. These advanced techniques support a wide range of applications, including memory assemblies, sensors with local signal conditioning and logic, photonics, and complex logic for AI and quantum computing.

During a keynote address, Columbia University Professor Keren Bergman will delve into the opportunities and challenges presented by co-packaging, which has the potential to revolutionize data center efficiency and performance for AI computing. Additionally, researchers from Broadcom and Siliconware Precision Industries will introduce the world's first 51.2Tbps Ethernet switch system with co-packaged optics, offering a significant boost in bandwidth and energy efficiency compared to existing solutions.

One of the intriguing topics to be explored at ECTC 2024 is backside power delivery for 3D device architectures, with Samsung presenting three distinct approaches to address this critical aspect of system design. The conference agenda spans a diverse array of subjects, including heterogeneous integration, photonics, materials, reliability, interconnect design, and advanced packaging technologies.

Professor Michael Mayer, the program chair for the 74th ECTC, emphasized the pivotal role of advanced packaging and component technologies in driving progress across various domains, from high-performance computing to IoT and quantum computing. With a record number of papers covering a wide spectrum of cutting-edge technologies, ECTC 2024 promises to be a milestone event in the realm of electronics and semiconductor innovation.