EU Japan agree to cooperate on beyond-2nm chips quantum

The European Union and Japan have agreed to collaborate on various technology topics, aiming to enhance their respective technology sovereignty. The areas of focus include semiconductor devices and processes beyond 2nm, chiplets and heterogeneous integration, artificial intelligence (AI), 5G and 6G communications, and quantum technology.

This agreement was formalized during the third digital partnership council meeting held in Tokyo, Japan on May 12. Chaired by Henna Virkkunen, the executive vice-president for technology sovereignty at the European Commission, the meeting paved the way for closer cooperation between the EU and Japan. Following the meeting, on May 13, Virkkunen and the Japanese Minister responsible for science and technology policy, Minoru Kiuchi, are scheduled to sign a Letter of Intent focusing on quantum technology collaboration.

In a joint statement released after the meeting, the EU and Japan emphasized the growing importance of their Digital Partnership and the collaborative efforts it fosters, particularly in light of current geopolitical challenges. The partnership is seen as a key driver for reinforcing mutual economic resilience, economic security, and promoting a rules-based international order.

Both Europe and Japan have historically been prominent players in the global chip market. However, in recent years, their positions have been overshadowed by the emergence of chip manufacturing powerhouses such as Taiwan, South Korea, and China. In response, Japan is striving to develop chip manufacturing capabilities at the cutting-edge 2nm technology node, aiming to regain a competitive edge in the industry.

Despite their efforts to catch up, both Japan and Europe have recognized the need to collaborate with established leaders in chip manufacturing. For instance, they have successfully engaged TSMC, a leading semiconductor foundry, to establish joint-venture wafer fabs in their respective regions. While these partnerships are crucial for meeting current chip demand, both regions are still working towards achieving technological advancements that will place them at the forefront of the industry.