Fraunhofer and EV Collaborate on 300mm 3D Quantum Chip

The EV Group (EVG) has announced a new collaboration with the Fraunhofer IZM-ASSID All Silicon System Integration division to focus on the development and optimization of alternative bonding and debonding technologies for 300mm CMOS and heterogeneous integration applications, including quantum computing.

Fraunhofer IZM-ASSID is taking a significant step by installing an EVG 850 DB fully automated UV laser debonding and cleaning system at its Centre for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. This move marks the beginning of Fraunhofer’s Bond-Hub initiative, which will encompass a range of cutting-edge temporary and permanent wafer-to-wafer and die-to-wafer bonding systems.

CEASAX represents a collaboration between Fraunhofer IZM-ASSID and the Fraunhofer Institute for Photonic Microsystems (IPMS), pooling their expertise to advance research in 300-mm, 3D heterogeneous wafer-level system integration and front-end semiconductor integration processes for applications such as high-performance neuromorphic computing, cryo- and quantum technology.

The EVG850 DB, the first system to be installed at CEASAX, will play a crucial role in helping Fraunhofer IZM-ASSID bridge critical process gaps and provide technology modules for the manufacturing of quantum systems within a 300mm cleanroom environment.

One of the key features of the EVG850 DB fully automated UV laser debonding and cleaning system is its ability to facilitate high-throughput, cost-effective room-temperature debonding for ultra-thin and stacked fan-out packages. By incorporating a solid-state UV laser and proprietary beam-shaping optics, the system enables optimized, force-free carrier lift-off, enhancing efficiency in the manufacturing process.

Temporary wafer bonding is a widely adopted technique for processing thin wafers, particularly those with silicon thicknesses under 100 microns. These thin wafers are essential for various applications, including 3D ICs, power devices, and fan-out wafer-level packaging (FOWLP), as well as for handling delicate substrates like compound semiconductors.

The debonding process, facilitated by the EVG850 DB, is a critical step in preparing the device wafer for subsequent processing stages leading to the integration of dies into the final device or application. Fraunhofer's ability to conduct these debonding processes in-house with the EVG850 DB will result in significantly reduced development times for optimal process flows using different bonding adhesive systems, enabling customization to meet the specific requirements of their diverse clientele.

“Fraunhofer and EV Group have a longstanding and successful partnership in developing new processes that have supported the advancement of emerging microelectronics applications,” stated Manuela Junghähnel, site manager at Fraunhofer IZM-ASSID. The acquisition of the EVG850 DB laser debonding and cleaning system marks an expansion of this collaboration, providing Fraunhofer with cutting-edge technology and reinforcing their joint efforts in developing new technologies for 3D device integration.

Markus Wimplinger, corporate technology development and IP director at EVG, expressed excitement about the extended collaboration, highlighting the opportunity to contribute to the development of new manufacturing processes for quantum systems. EVG's suite of wafer bonding, lithography, and metrology solutions are instrumental in enabling the development and high-volume manufacturing of technology innovations in advanced packaging and other areas.

EVG's recent advancements in hybrid bonding, wafer bond alignment technology, IR laser release technology, maskless exposure for FOWLP, and NIL and resist processing demonstrate their commitment to addressing evolving industry needs and driving innovation in semiconductor manufacturing.

For more information on the EVG850 DB UV laser debonding and cleaning system, visit EV Group's website.