HBM4 Standard Doubles Channel Count for AI Boost

The JEDEC Solid State Technology Association has recently announced the publication of its standard for HMB4 high-speed memory, which represents a significant advancement in memory technology. This new standard doubles the channel count from 16 to 32, resulting in higher performance capabilities for a wide range of applications.

Known as JESD270-4 HBM4, this latest standard brings higher bandwidth and larger stacks of higher capacity DRAM memory die, particularly benefiting AI chips. With transfer speeds reaching up to 8 Gb/s across a 2048-bit interface, HBM4 can boost total bandwidth up to an impressive 2 TB/s with two pseudo-channels per channel.

One notable feature of HBM4 is its support for various stack configurations, including 4-high, 8-high, 12-high, and 16-high stack of DRAM die. These configurations can have densities of 24 Gbit or 32 Gbit, resulting in a higher cube density of 64GB. This provides designers with increased flexibility and independent access to memory resources.

Moreover, the standard introduces vendor-specific voltage levels for the data output buffers (VDDQ) and the VDDC core, allowing for lower power consumption and improved energy efficiency. This is a crucial aspect in the development of energy-efficient systems, especially in power-sensitive applications.

According to Joe Macri, Senior Vice President and Compute and Graphics CTO at AMD, "The introduction of HBM4 marks a critical step forward in high-bandwidth memory innovation, delivering the performance, efficiency, and scalability required to power the next generation of AI, HPC, and graphics workloads."

Furthermore, the HBM4 interface definition ensures backward compatibility with existing HBM3 controllers, enabling seamless integration and flexibility in various applications. This compatibility allows a single controller to work with both HBM3 and HBM4, providing versatility and ease of adoption for developers and system integrators.

As the industry continues to evolve, the demand for higher memory bandwidth in AI hardware systems is becoming increasingly critical. The HBM4 standard addresses this need by offering significant enhancements in memory performance and efficiency, catering to the growing requirements of AI, HPC, and graphics applications.

With the active involvement of industry leaders and ecosystem collaborators, the development and adoption of the HBM4 standard are expected to drive innovation and set new benchmarks in memory technology. Companies like Micron and Samsung have played pivotal roles in the standardization process, contributing to the growth and advancement of HBM technology.

Overall, the adoption of the HBM4 JEDEC Standard represents a significant milestone in memory technology, promising higher bandwidth, improved power efficiency, and enhanced performance for a wide range of applications. As technology continues to advance, the role of high-bandwidth memory in driving AI performance and efficiency will become increasingly crucial, shaping the future of computing and data processing.

For those interested in exploring the details of the JESD270-4 HBM4 standard, it is available for download on the JEDEC website, providing valuable insights into the latest advancements in memory technology.