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JEDEC Nears Completion of HBM4 Standard

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July 15, 2024

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The High Bandwidth Memory 4 (HBM4) standard represents a significant advancement from its predecessor, HBM3, featuring a double channel per stack and a larger physical footprint. In a strategic move to facilitate adoption, JEDEC has ensured that a single controller can seamlessly operate with both HBM3 and HBM4 technologies.

As the industry prepares for the transition to HBM4, it is essential to consider the various configurations that will necessitate different interposers to accommodate the distinct footprints of the new standard. HBM4 is set to define 24 Gbit and 32 Gbit DRAM layers, offering flexibility with options for supporting 4-high, 8-high, 12-high, and 16-high Through-Silicon Via (TSV) stacks. The committee overseeing the standardization process has reached initial agreements on speed bins of up to 6.4 Gbps, with ongoing discussions focusing on achieving even higher frequencies.

In a notable development, SangJoon Hwang, the head of the DRAM team at Samsung Electronics, shared insights in October 2023, expressing expectations for the introduction of HBM4 products by 2025. Hwang highlighted that these upcoming products would leverage technologies optimized for high thermal performance, including non-conductive film assembly and hybrid copper bonding.

For more information on the latest advancements in memory technology standards, visit the official JEDEC website at www.jedec.org.

Recent industry updates have showcased the progress made by key players in the memory technology sector. SK Hynix has commenced volume production of what is being touted as the 'best' HBM3E memory, signaling a commitment to pushing the boundaries of high-bandwidth memory solutions. Meanwhile, Samsung has made strides by achieving a 12-high configuration with its HBM3E 36Gbyte DRAM, demonstrating a dedication to innovation and performance.

Not to be outdone, Micron has also entered the arena by initiating the production of a 'better' HBM3E memory variant, further intensifying the competition and driving advancements in memory technology. These developments underscore the industry's relentless pursuit of enhancing memory capabilities to meet the evolving demands of modern computing applications.

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