LG Partners with Blue Cheetah for AI Chiplet Design

Blue Cheetah Analog Design in the US and LG Electronics have joined forces to develop a cutting-edge generation of chiplets. This collaboration has already seen LG tape out silicon using the Blue Cheetah chiplet interconnect, paving the way for future AI-enabled products. The successful silicon bring-up of a complex System-in-Package (SiP) marks a significant milestone, incorporating chiplets with processors, DDR memory interfaces, AI accelerators, and Blue Cheetah’s die-to-die (D2D) interconnect.

Blue Cheetah offers customizable physical (PHY) and link layer chiplet interfaces in various nanometer ranges, spanning from 16nm down to 4nm and below, available across multiple semiconductor foundries. The IP provided supports a range of packaging options, from standard to advanced, accommodating various bump pitches, metal stacks, and orientations. The physical (PHY) IP solutions seamlessly integrate with on-die buses utilizing popular standards like AMBA CHI, AXI, and ACE.

The chiplet IP is designed to comply with the Universal Chiplet Interconnect Express (UCIe) and Open Compute Project (OCP) Bunch of Wires (BoW) standards, ensuring compatibility and interoperability across different platforms. This strategic alignment between Blue Cheetah and LG signifies a commitment to driving innovation in the semiconductor industry and pushing the boundaries of chiplet technology.

Kim Jin-Gyeong, SVP and Head of SoC R&D Centre at LG, expressed confidence in the partnership, stating, “We selected Blue Cheetah due to their ability to provide the quickest and least risky route to tailored chiplet interconnect solutions that could be leveraged across our product portfolio. The BlueLynx die-to-die interconnect IP enables us to amalgamate chiplets produced in diverse process technologies, enabling more cost-effective scalability and enhanced IP reuse.”

Elad Alon, CEO of Blue Cheetah, echoed this sentiment, saying, “We are thrilled to collaborate with LG, a prominent player in the TV manufacturing industry and a pioneer in home appliances, air solutions, and home entertainment. The successful silicon bring-up of a complex SiP represents just the beginning of our journey together. We are eager to forge a fruitful partnership with LG to develop groundbreaking chiplet solutions that will shape the future of technology.”