Electronic Breaking News

Ultra Low Power Microcontrollers Set to Capture $15 Billion Market by 2030

Ultra Low Power Microcontrollers Set to Capture $15 Billion Market by 2030

The global market for ultra-low-power (ULP) microcontrollers is on track for strong growth, projected to reach $15.27 billion by 2030 from $9.78 billion in 2025 according to a new MarketsandMarkets report. Rising energy-efficiency demands in consumer electronics and the spread of smart...

Published on: September 06, 2025

Novocomms 5G mmWave FWA Solution Expands Connectivity

Novocomms 5G mmWave FWA Solution Expands Connectivity

UK-based antenna specialist Novocomms has developed a new 5G mmWave fixed wireless access (FWA) solution designed to deliver fibre-like data rates to rural, maritime, and underserved areas. Backed by the UK government’s Small Business Research Initiative (SBRI), the company’s customer premises equipment...

Published on: September 05, 2025

ASML showcases lithography solutions at SEMICON India 2025

ASML showcases lithography solutions at SEMICON India 2025

ASML, a Dutch company known worldwide for its cutting-edge lithography systems, made its debut at SEMICON India 2025, highlighting its commitment to the country’s fast-growing semiconductor ambitions. ASML presented its holistic lithography solutions, combining hardware, software, metrology, and inspection technologies.nFor eeNews Europe...

Published on: September 05, 2025

Synopsys brings GenAI capabilities to EDA

Synopsys brings GenAI capabilities to EDA

Synopsys has enhanced its Synopsys.ai Copilot generative AI (GenAI) capabilities to further support semiconductor design solutions, providing semiconductor engineering teams with the tools to expedite development timelines, handle more complex designs, and enhance capabilities in the face of a workforce shortage.The GenAI...

Published on: September 04, 2025

Asahi Kasei to Double PSPI Production Capacity by 2030

Asahi Kasei to Double PSPI Production Capacity by 2030

Asahi Kasei, a leading materials manufacturer, has announced its ambitious plan to double the production capacity of photosensitive polyimide (PSPI) for semiconductors by 2030. This strategic move involves investing ¥16 billion (€100m) in its Fuji City facility in Japan, emphasizing the company’s...

Published on: September 03, 2025

Espressif Launches ESP_IMAGE_EFFECTS Solution

Espressif Launches ESP_IMAGE_EFFECTS Solution

Espressif has introduced ESP_IMAGE_EFFECTS v1.0.0, a lightweight yet powerful image-processing library tailored for embedded systems. This release offers developers a unified API and optimized performance for tasks like scaling, rotation, cropping, and color space conversion.For eeNews Europe readers involved in smart cameras,...

Published on: September 02, 2025

CNES and UNIVITY collaborate on French space-based 5G

CNES and UNIVITY collaborate on French space-based 5G

CNES has awarded €31 million in strategic funding to UNIVITY, formerly Constellation Technologies and Operations, as part of a France 2030 call for projects operated by CNES. This support marks a decisive step in the development of space-based 5G made in France.While...

Published on: September 01, 2025

Optical switches for AI and HPC networks

Optical switches for AI and HPC networks

FS has recently unveiled its DCS-W Series Optical Circuit Switches (OCS), specifically designed to cater to the advanced connectivity demands of AI, HPC, and machine learning clusters. These optical switches are equipped with a fully non-blocking all-optical switch architecture and incorporate a...

Published on: September 01, 2025

dToF sensor enhances 3D spatial detection

dToF sensor enhances 3D spatial detection

The TMF8829 dToF sensor from ams OSRAM has revolutionized distance sensing technology by significantly increasing resolution from the previously standard 8×8 zones to an impressive 48×32. This direct Time-of-Flight (dToF) sensor is designed to detect subtle spatial differences and distinguish closely spaced...

Published on: September 01, 2025

CISA Releases Draft SBOM Guide for Public Comment

CISA Releases Draft SBOM Guide for Public Comment

The US Cybersecurity and Infrastructure Security Agency (CISA) has released a draft update of its Software Bill of Materials (SBOM) minimum elements, inviting public feedback on the proposed guidance through October 3, 2025. The draft aims to reflect the progress made in...

Published on: August 29, 2025