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Nvidia ships Jetson Thor AI chips

Nvidia ships Jetson Thor AI chips

Nvidia has recently announced the shipment of its highly anticipated Jetson Thor GPU chip designed for embedded AI applications. The chip comes in two versions, the T5000 and T4000, each tailored for specific use cases such as humanoid robots, image processing, and...

Published on: August 20, 2025

Softbank Backs Intel in $2 Billion Deal

Softbank Backs Intel in $2 Billion Deal

Softbank, the Japanese conglomerate, has made a significant investment of $2 billion into Intel, a move aimed at bolstering the struggling chip maker. This investment serves as a clear signal to the Trump administration that both Intel and SoftBank are reinforcing their...

Published on: August 19, 2025

150mm fab closures pose structural industry risk

150mm fab closures pose structural industry risk

The phase-out of 150mm CMOS is not just a product change; it is a structural industry risk that is causing significant disruptions in the semiconductor market, according to Dr. Ulrich Bretthauer at X-Fab. Manufacturers across various sectors such as automotive, industrial, medical,...

Published on: August 19, 2025

4D LiDAR for Smart Infrastructure, Traffic Control, and Security

4D LiDAR for Smart Infrastructure, Traffic Control, and Security

Aeva has unveiled the Atlas Orion, a cutting-edge 4D LiDAR sensor designed to revolutionize smart infrastructure and security systems. This innovative sensor is engineered to gather situational data while ensuring the privacy of individuals by not capturing any personally identifiable information, addressing...

Published on: August 18, 2025

Tiling process mounts InP optical devices on 300mm substrate

Tiling process mounts InP optical devices on 300mm substrate

Oki Electric Industry in Japan has leveraged its crystal film bonding (CFB) technology to achieve the mounting of optical components from 50mm wafers onto larger 300mm silicon wafers. This innovative Tiling CFB approach facilitates the heterogeneous integration of small-diameter optical semiconductor wafers...

Published on: August 15, 2025

Spirent and Telescent collaborate on optical switching for test lab automation

Spirent and Telescent collaborate on optical switching for test lab automation

Spirent Communications has recently announced a global strategic partnership with Telescent, focusing on integrating high-density optical switching into Spirent’s Velocity test lab automation portfolio. The collaboration aims to enhance operational efficiency, improve resiliency, and optimize connectivity for AI/ML workloads. This partnership is...

Published on: August 14, 2025

Wireless Projects and Engineering Insights: Elektor Lab Talk 37

Wireless Projects and Engineering Insights: Elektor Lab Talk 37

Exciting news for tech enthusiasts! Elektor Lab Talk is back on Thursday, August 21 at 16:00 CEST with a special session focusing on the latest advancements in wireless technologies and IoT applications. Hosted by Brian Tristam Williams and Jens Nickel, the session...

Published on: August 14, 2025

Elektor Engineering Insights on Software-Defined Vehicles

Elektor Engineering Insights on Software-Defined Vehicles

On August 27, 2025, Elektor is set to host the 55th edition of its Engineering Insights series, featuring Dr. Dirk Slama, Vice President Partner Ecosystems at Bosch and Chairman of the digital.auto initiative. The live session, moderated by Elektor Editor Brian Tristam...

Published on: August 14, 2025

Best practice for automotive AI sensor setup

Best practice for automotive AI sensor setup

AImotive, based in Hungary, has developed comprehensive guidelines for sensor setup and data collection specifically tailored for automotive AI systems. The process of developing automotive AI for Advanced Driver Assistance Systems (ADAS) or automated driving hinges on the foundation of high-quality, precise,...

Published on: August 14, 2025

QSMP-25 Module Integrates STM32 MPU for Edge AI

QSMP-25 Module Integrates STM32 MPU for Edge AI

Direct Insight has recently unveiled the QSMP-25, a compact 29 mm² QFN-style solder-down system-on-module (SoM) centered around STMicroelectronics’ second-generation STM32MP255F microprocessor. This STM32 MPU module integrates dual ARM Cortex-A35 processors with a Cortex-M33 microcontroller, NPU, and GPU, making it well-suited for secure...

Published on: August 13, 2025

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