Electronic Breaking News

Telecom Giants Collaborate on LLMs for Customer Service

Telecom Giants Collaborate on LLMs for Customer Service

SK Telecom, Deutsche Telekom, e& Group, Singtel, and SoftBank have joined forces to establish the Global Telco AI Alliance (GTAA) with the aim of developing Large Language Models (LLMs) customized specifically for the telecommunications industry.At the inaugural meeting of the alliance, key...

Published on: February 27, 2024

Tenstorrent Partners with LSTC

Tenstorrent Partners with LSTC

Japan’s $300 million government-backed chip development group, LSTC (Leading-edge Semiconductor Technology Centre), has announced a strategic partnership with Jim Kelly’s Tenstorrent start-up to collaborate on the design of its first AI integrated circuit (IC), according to a report by Bloomberg.LSTC and Tenstorrent...

Published on: February 27, 2024

Nvidia Expands Ada Lovelace Architecture for Laptop GPUs

Nvidia Expands Ada Lovelace Architecture for Laptop GPUs

Nvidia continues to expand its lineup of laptop GPUs based on the Ada Lovelace architecture, unveiling the RTX 500 and 1000 Ada Generation GPUs designed for portable mobile workstations. These new additions build upon the success of the previously released RTX 2000...

Published on: February 27, 2024

New Chiplet DC-DC Converter Unveiled for 1kW Processors at ISSCC

New Chiplet DC-DC Converter Unveiled for 1kW Processors at ISSCC

Instantaneous power demand on large processor ICs is reaching unprecedented levels, with a thousand amps flowing through them at times. This surge in power requirements has prompted Intel to explore innovative solutions for future system-in-package designs that are expected to consume around...

Published on: February 26, 2024

Integrated IC for Motor MOSFETs with Microcontroller, CAN, and Gate Drivers

Integrated IC for Motor MOSFETs with Microcontroller, CAN, and Gate Drivers

Microchip is making waves in the field of motor control with its innovative approach of combining a triple half-bridge mosfet gate driver, a powerful 100MHz processor, and a cutting-edge CAN FD interface all within the same integrated circuit (IC).While some members of...

Published on: February 26, 2024

New AI Embedded Accelerator Unveiled for Robotics at ISSCC 2022

New AI Embedded Accelerator Unveiled for Robotics at ISSCC 2022

Renesas, a leading semiconductor company, recently introduced a groundbreaking AI accelerator designed for real-time processing of lightweight algorithms in robots. The company showcased this cutting-edge technology at the prestigious International Solid-State Circuits Conference held in San Francisco.The AI accelerator developed by Renesas...

Published on: February 26, 2024

Humanoid Robot Startup Attracts Investor Interest

Humanoid Robot Startup Attracts Investor Interest

Several tech giants and venture capital firms, including Amazon, Nvidia, OpenAI, and Microsoft, have joined forces to raise a substantial $675 million investment for a promising startup named FigureAI. This startup is focused on the development of humanoid robots, as reported by...

Published on: February 26, 2024

TSMC Launches First of Three Japanese Fabs

TSMC Launches First of Three Japanese Fabs

On Saturday, Taiwan Semiconductor Manufacturing Company (TSMC) made a significant move by opening its first Japanese fab in Kumamoto, located on the island of Kyushu. The inauguration ceremony was attended by Japanese Prime Minister Fumio Kishida, who participated via video link. During...

Published on: February 26, 2024

Intel Capital Invests in Skylo’s Direct-to-Device Satellite Connectivity

Intel Capital Invests in Skylo’s Direct-to-Device Satellite Connectivity

Skylo Technologies, a non-terrestrial network (NTN) service provider, has recently announced securing $37 million in funding from a group of investors co-led by Intel Capital and Innovation Endeavors. This significant investment is expected to propel Skylo's innovative approach to 5G satellite-to-device communications...

Published on: February 23, 2024

New ST ToF 3D LiDAR Module Boasts 2.3k Resolution

New ST ToF 3D LiDAR Module Boasts 2.3k Resolution

ST has introduced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR module featuring a market-leading 2.3k resolution. Additionally, the company has disclosed an early design win for the world's smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.The newly announced VL53L9 is a direct ToF 3D...

Published on: February 23, 2024