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Breakthrough: First 5G NTN Link via Geostationary Satellite

Breakthrough: First 5G NTN Link via Geostationary Satellite

Researchers in Korea have achieved a groundbreaking milestone by successfully demonstrating the first 5G non-terrestrial network (NTN) link from a geostationary satellite. This achievement marks a significant advancement in the realm of telecommunications technology.Utilizing a geostationary satellite for 5G NTN offers a...

Published on: October 01, 2024

MIPI A-PHY 2.0 Enhances Data Links at 32Gbit/s

MIPI A-PHY 2.0 Enhances Data Links at 32Gbit/s

The MIPI Alliance has recently unveiled the latest iteration of its A-PHY specification, known as A-PHY v2.0, specifically tailored for software-defined vehicles and driverless cars. This updated version aims to enhance the integration of image sensors and displays in next-generation ADAS and...

Published on: October 01, 2024

Revolutionary 20 Gbps Universal USB Peripheral Controller Unveiled

Revolutionary 20 Gbps Universal USB Peripheral Controller Unveiled

The EZ-USB FX20 peripheral controller is revolutionizing high-speed connectivity with its USB 20 Gbps and LVDS interfaces, offering a significant increase in total bandwidth compared to its predecessor, the EZ-USB FX3.According to Ganesh Subramaniam, Senior Vice President and General Manager of the...

Published on: October 01, 2024

Harwin Unveils Robust Board-to-Board Connectors

Harwin Unveils Robust Board-to-Board Connectors

The upcoming exhibition will showcase Harwin's cutting-edge board-to-board connectors that are tailored to meet stringent size, weight, and reliability requirements, all while supporting high data rates and being compatible with high-speed automated manufacturing processes.One of the standout technologies from Harwin that will...

Published on: October 01, 2024

CGD Participates in G7 and OECD Semiconductor Events

CGD Participates in G7 and OECD Semiconductor Events

Cambridge GaN Devices (CGD) is actively engaging in two significant international events focused on enhancing the resilience of the semiconductor value chain and fostering information exchange and collaboration among governments in the semiconductor sector.On 26th September, Simon Stacey, the Chief Commercial Officer...

Published on: October 01, 2024

Advantech Unveils Scalable Edge Service Packages for IoT Applications

Advantech Unveils Scalable Edge Service Packages for IoT Applications

Edge-as-a-Service is a cutting-edge concept that involves the seamless integration of hardware, edge software, and cloud services to streamline edge orchestration. This innovative approach plays a crucial role in driving successful digital transformation by harnessing the synergy between Edge and Cloud technologies....

Published on: October 01, 2024

Introducing the 6W Wireless Power Evaluation Board

Introducing the 6W Wireless Power Evaluation Board

Eggtronic, a leading innovator in wireless power technology, has introduced a groundbreaking evaluation board that leverages a RISC-V controller to enable the rapid prototyping of efficient wireless power transfer designs for low-power applications. Known as the Eggtronic WaveEgg LP EVB, this cutting-edge...

Published on: October 01, 2024

Toppan Photomask Rebrands as Tekscend Photomask

Toppan Photomask Rebrands as Tekscend Photomask

Toppan Photomask, a subsidiary of Toppan Holdings Inc. based in Tokyo, Japan, is undergoing a significant transformation. The company has announced that all its regional subsidiaries will now be known as Tekscend, replacing the familiar Toppan branding in their company names.This move...

Published on: October 01, 2024

Qualcomm Finalizes 4G IoT Tech Deal with Sequans

Qualcomm Finalizes 4G IoT Tech Deal with Sequans

Qualcomm Technologies has successfully finalized the acquisition of the 4G IoT technology developed by Sequans in France. This strategic move is expected to enhance Qualcomm's existing portfolio of purpose-built connectivity solutions for the Internet of Things (IoT) through licensing agreements. The acquisition...

Published on: October 01, 2024

TactoTek Collaborates on Automotive 3D Molded Electronics

TactoTek Collaborates on Automotive 3D Molded Electronics

TactoTek, a leader in In-Mold Structural Electronics (IMSE) technology, has joined forces with Industrias Alegre in Spain to revolutionize 3D integrated electronics for the automotive and other high-demand industries. This collaboration aims to develop highly integrated user interfaces (HMI) that incorporate lighting,...

Published on: October 01, 2024

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