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€3m European Project Aims for Sustainable Energy Harvesting

€3m European Project Aims for Sustainable Energy Harvesting

A groundbreaking €3.1 million European project is paving the way for a sustainable platform in energy harvesting. The SELECT (Sustainable Electronics for Energy Harvesting Applications) project has brought together key technology developers to create a complete battery-free platform tailored for IoT designs.The...

Published on: September 26, 2024

Ensilica Inks 10-Year Microwave Chip Deal in Italy

Ensilica Inks 10-Year Microwave Chip Deal in Italy

Ensilica, a UK-based company, has entered into a groundbreaking partnership with Siae Microelettronica in Italy to design custom microwave and RF telecoms chips. This strategic collaboration is part of a ten-year deal that will see Ensilica developing Application-Specific Integrated Circuits (ASICs) for...

Published on: September 26, 2024

Silvaco Enhances Digital Twin Tool for Cryo CMOS, FinFET, and GAA Technologies

Silvaco Enhances Digital Twin Tool for Cryo CMOS, FinFET, and GAA Technologies

Silvaco, a leading provider of simulation software for semiconductor devices, has recently announced the expansion of its TCAD digital twin tool to support the latest CMOS FinFET and GAA transistor technologies, as well as planar devices down to 1 Kelvin.The 2024 TCAD...

Published on: September 26, 2024

Greenerwave Introduces RIS Technology for FR1, FR2, and FR3 Bands

Greenerwave Introduces RIS Technology for FR1, FR2, and FR3 Bands

Greenerwave is at the forefront of innovation in the telecommunications industry by offering Reconfigurable Intelligent Surfaces (RIS) in FR1, FR2, and FR3 bands. This unique RIS offering is set to advance research in this future-oriented field and unlock new use cases in...

Published on: September 26, 2024

Bending the Rules with RISC-V

Bending the Rules with RISC-V

Nature journal has recently published an innovative research article by Pragmatic Semiconductor, unveiling a groundbreaking Bendable Non-silicon RISC-V Microprocessor. This cutting-edge technology represents a significant milestone as the world's first 32-bit microprocessor designed to be flexible while maintaining full functionality even when...

Published on: September 26, 2024

Ceva and Edge Impulse Collaborate for Rapid AI Development

Ceva and Edge Impulse Collaborate for Rapid AI Development

The collaboration between Ceva and NeuPro-Nano marks a significant milestone in the realm of embedded AI development. This unique partnership, centered around an NPU IP, empowers developers to benchmark and enhance the performance of their edge AI models within the Edge Impulse...

Published on: September 26, 2024

Compact Supercomputer Boosts Military AI Processing

Compact Supercomputer Boosts Military AI Processing

Introducing the A230 Vortex, a compact yet powerful embedded computer designed to excel in AI, deep learning, and video and signal processing applications in harsh and remote environments. This cutting-edge system is tailored for distributed systems that require reliable operation under challenging...

Published on: September 26, 2024

AI Enhances Infrastructure Defect Detection

AI Enhances Infrastructure Defect Detection

Artificial intelligence (AI) is revolutionizing the way railway safety is ensured by enabling automated inspections of various critical components such as tracks, crossties, ballasts, and retaining walls. Researchers at EPFL’s Intelligent Maintenance and Operations Systems (IMOS) Laboratory have made significant strides in...

Published on: September 26, 2024

EVs Navigate Technology Challenges on Path to Sustainability

EVs Navigate Technology Challenges on Path to Sustainability

Battery traceability has become a crucial aspect of the electric vehicle (EV) market, with advancements in technology playing a key role in addressing challenges such as cost, sustainability, range, and efficiency. The cost of EVs is primarily driven by the battery, but...

Published on: September 26, 2024

Synopsys and TSMC Explore 1.6nm Backside Routing for Trillion-Transistor AI and Multi-Die Chips

Synopsys and TSMC Explore 1.6nm Backside Routing for Trillion-Transistor AI and Multi-Die Chips

Synopsys recently unveiled its groundbreaking 1.6nm projects for backside power routing, a development that is poised to play a crucial role in the creation of trillion transistor chips. Collaborating with TSMC, Synopsys is integrating backside routing capabilities into TSMC's A16 1.6nm process...

Published on: September 26, 2024

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