In a groundbreaking study, researchers from the University of Southern California (USC) have unveiled a new quantum sensing technique that overcomes the limitations of decoherence, surpassing traditional methods by a wide margin. This innovative technique has the potential to accelerate advancements in...
Published on: April 29, 2025
The Government of Spain has recently unveiled its inaugural Quantum Technologies Strategy, backed by a substantial investment of €800 million. The primary objective of this funding initiative is to bolster the Spanish quantum ecosystem, both in terms of research advancements and market...
Published on: April 29, 2025
A recent global survey of 597 design verification engineers and executives has revealed a concerning trend - a significant decrease in first-time-right IC designs in 2024. The data shows that only 14 percent of IC designs are proven correct on the initial...
Published on: April 29, 2025
Over the years, landing on a specific date for technology launches has proven to be a challenge for many companies, including the UK processor core designer ARM. The journey of ARM began with the tape out of the first ARM processor, the...
Published on: April 29, 2025
When the UK government made the surprising move to acquire a semiconductor fab in Durham, one of the primary questions that arose was who would be at the helm of this new venture. The answer to that question is now on the...
Published on: April 28, 2025
Researchers at the Nagoya Institute of Technology in Japan have made a significant breakthrough in wireless communication technology with the development of a passive metasurface that can effectively combat multipath signal interference. This innovative metasurface does not require a powered filter to...
Published on: April 28, 2025
Cambridge GaN Devices (CGD) has collaborated with IFP Energies nouvelles (IFPEN) in France to develop a cutting-edge three-level power inverter for electric vehicles utilizing its integrated gallium nitride power device. This innovative project will be showcased at the upcoming PCIM power exhibition...
Published on: April 28, 2025
Filtronic has entered into a collaboration with the European Space Agency (ESA) and Viasat as part of the Direct-to-Device (D2D) initiative. The company is contributing advanced feeder link technology to facilitate seamless connectivity between Earth and an open-architecture LEO network. This partnership...
Published on: April 28, 2025
UK chip design house Sondrel has re-branded as Aion Silicon as it joins the Intel Foundry alliance. Aion provides design services and chip production services down to the 3nm leading edge process at foundries such as TSMC and Samsung with over 100...
Published on: April 28, 2025
TSMC has unveiled an innovative Integrated Voltage Regulator (IVR) tailored for AI applications, boasting an impressive five times the vertical power density delivery compared to a traditional discrete design. This breakthrough comes at a crucial time as the latest AI datacentre chips...
Published on: April 27, 2025