Rapidus Collaborates with Fraunhofer on 2nm Packaging Tech

Rapidus, a leading semiconductor company, has embarked on a groundbreaking collaboration with Fraunhofer IZM in Germany to develop cutting-edge packaging technology for its 2nm gate all around (GAA) chips. This partnership marks a significant milestone in the semiconductor industry, as both companies pool their expertise to revolutionize chip packaging.

As part of its strategic plan, Rapidus is constructing a state-of-the-art plant in Hokkaido, Japan, leveraging the 2nm semiconductor knowledge from IBM and the specialized skills of Fraunhofer IZM. Henri Richard, the general manager of Rapidus Design Solutions, emphasized the importance of packaging in the semiconductor manufacturing process. He stated, "A high-end chip is the baseline, and customers are increasingly encountering challenges in the backend rather than the frontend."

"Our goal is to establish Hokkaido as a hub for backend innovation, setting us apart from competitors by creating the industry's first fully integrated front and back end fab," Richard explained. The company envisions a revolutionary approach to chip integration, aiming to enhance efficiency and performance significantly.

Dr. Michael Schiffer, a project leader at Fraunhofer IZM, expressed enthusiasm for the collaboration with Rapidus, highlighting the focus on developing advanced packaging technology alongside cutting-edge chip technology. The partnership aims to achieve best-in-class performance through a holistic approach to semiconductor design and packaging.

Furthermore, the collaboration extends to include packaging company A star in Singapore, expanding the scope of expertise and resources dedicated to advancing semiconductor packaging technology. With a commitment to innovation and collaboration, Rapidus and its partners are poised to drive significant advancements in the semiconductor industry.