Revolutionary High-Temperature Flex PCB Unveiled

Yamaichi Electronics has introduced a new version of its YFLEX flexible printed circuit board (FPC) that is specifically designed to withstand high temperatures in extreme environments. This development comes as a response to the increasing demand for heat-resistant FPCs in industries such as automotive, semiconductor manufacturing, and test and measurement technology.

The key feature of the YFLEX high-heat resistant FPC is its improved insulating layer, which offers enhanced adhesion due to the use of a special cover layer. This innovation allows the FPC to maintain its electrical properties for over 3,000 hours even under extreme temperatures of up to 150°C. The continuity resistance remains within a rate of change of ±10%, and the insulation resistance is 500 MΩ or higher. These exceptional resistance characteristics ensure the reliable performance of the FPC in the most adverse environments.

Yamaichi Electronics emphasizes the versatility of the YFLEX FPC, which can be produced in both single-layer and double-layer configurations. The choice of insulation substrate base, either liquid crystal polymer (LCP) or polyimide (PI), allows for optimal adaptation to different applications. This flexibility makes the YFLEX FPC suitable for a wide range of industries and use cases.

In addition to its high-heat resistance, the YFLEX FPC also features a reinforced GND design that provides noise resistance. This design further enhances the reliability and performance of the FPC, making it suitable for applications that require both high-heat resistance and noise resistance.

With the introduction of the YFLEX high-heat resistant FPC, Yamaichi Electronics aims to meet the growing demand for reliable and durable circuit boards in industries that operate in extreme environments. The company's commitment to innovation and quality ensures that their products meet the highest standards and deliver exceptional performance.