SGET updates OSM module specification

The Standardization Group for Embedded Technologies (SGET) has updated its OSM (Open Standard Module) Specification 1.2 to boost the connectivity of standard embedded modules.

A newly updated OSM Design Guide 1.1 expands the guidance with insights on designing with the modules.

OSM Specification 1.2 introduces several targeted updates that extend the flexibility and functionality of the leading standard for soldered-on modules with an enhanced LVDS Interface as a single-channel option on Size-S modules, previously exclusive to Size-L, broadening potential applications and compatibility.

A second CSI Interface extends compatibility to Size-M modules, allowing for enhanced connectivity across various design sizes while a second I2S Interface means there are two  interfaces on Size-0 modules

The refinements to the OSM Specification 1.2 documentation improve clarity and readability, thus simplifying the implementation process for developers. Minor adjustments and additional explanations help close any specification gaps, making complex technical requirements more approachable. Complementing these updates, the new OSM Design Guide 1.1 provides expanded guidance, offering detailed insights to support smooth integration and optimal performance across a wide range of applications.

“Releasing OSM Specification 1.2 marks a significant milestone for SGET as we continue to drive innovation in soldered-on module standards,” said Ansgar Hein, Chairman of the Board at SGET. “Our mission is to make these standards increasingly versatile, accessible, and future-ready. We’re proud of our SDT.05 team’s commitment to quality and look forward to seeing the industry leverage these advancements.”

SGET is a globally recognized organization dedicated to advancing and standardizing embedded computing technologies with the OSM specification providing a scalable, reliable approach for a wide range of embedded applications.