Silicon Valley Welcomes Ten Teams for Packaging R&D Center

Ten US and Japanese companies have joined forces to establish the US-JOINT Consortium, aimed at constructing a cutting-edge packaging R&D plant to develop next-generation semiconductor packaging technologies. Leading the consortium is Resonac, a Japanese materials firm formerly known as Showka Denko, with prior involvement in similar projects in Japan.

The consortium includes American and Japanese semiconductor materials and equipment companies such as Azimuth, KLA, Kulicke & Soffa, Moses Lake Industries, MEC, ULVAC, NAMICS, TOK, and TOWA. Each member brings unique contributions to the project, fostering collaboration and innovation in the semiconductor industry.

US-JOINT operates as an open consortium, facilitating collaboration with end-customers to validate new concepts and meet the evolving requirements for semiconductor packaging of advanced devices. The consortium's focus on innovation and partnership sets it apart in the industry.

R&D activities will be conducted at a new facility in Union City, California, established through joint investment by the consortium partners. Construction of cleanrooms and equipment installation is scheduled to commence this year, with the facility expected to be fully operational by 2025.

"The demand for next-generation semiconductors, driven by applications like generative AI and autonomous driving, necessitates advancements in packaging technologies such as 2.5D and 3D," stated Hidenori Abe, Executive Director of Electronics Business Headquarters at Resonac. The US-JOINT Consortium aims to address these evolving needs with its expertise in materials and equipment.

Advanced packaging and back-end processing of semiconductors have traditionally been centered in Asia, making the US-JOINT Consortium a significant player in expanding these capabilities in the United States. By focusing on critical areas like substrate advancements and package fabrication, the consortium aims to drive innovation and competitiveness in the industry.

As the semiconductor industry continues to evolve, collaboration between trusted partners becomes essential to strengthen supply chains and drive technological advancements. Rahm Emanuel, the US Ambassador to Japan, emphasized the importance of partnerships in accelerating the development of critical technologies, highlighting the US-JOINT Consortium as a prime example of US-Japan cooperation.

Key contributions from consortium members include Azimuth Industrial's assembly capabilities, KLA's laser direct imaging systems, and Kulicke and Soffa Industries' Fluxless Thermo-Compression Bonder. These technologies play a crucial role in advancing semiconductor packaging and meeting the demands of emerging applications like AI.

NAMICS is providing liquid compression molding materials, TOK is supplying photoresist, and Towa is contributing compression molding equipment, showcasing the diverse expertise within the consortium. ULVAC's sputtering and ashing systems further enhance the consortium's capabilities in semiconductor manufacturing.

"Our goal is to establish packaging technology concepts as the industry standard and drive innovation in manufacturing equipment," said Harunori Iwai, Executive Officer at ULVAC. The consortium's activities in Silicon Valley aim to showcase cutting-edge efforts and foster innovation in the heart of technological advancement.

For more information about the US-JOINT Consortium and its members, visit www.resonac.com.