SK Hynix, a leading semiconductor manufacturer, has announced plans to construct a cutting-edge semiconductor cluster in Yongin, located south of Seoul. This ambitious project will consist of four fabs, with construction set to commence in March 2025 and expected to be completed by May 2027. The company revealed that the new facility will primarily focus on producing HBM DRAMs, while also gearing up to manufacture a range of other innovative products.
The Yongin Cluster will be situated on a vast 4.15 million square meter site in Wonsam-myeon, Yongin, Gyeonggi Province. Currently, the area is undergoing extensive site preparation and infrastructure development in anticipation of the upcoming construction. SK Hynix envisions Yongin as evolving into a prominent global hub for AI semiconductor production, reflecting the company's commitment to technological advancement and industry leadership.
Following the completion of the initial fab, SK Hynix's strategic roadmap includes the sequential construction of the remaining three fabs. This phased approach is designed to transform the Yongin Cluster into a world-class center for AI semiconductor manufacturing. Moreover, the company plans to establish a Mini-fab research facility equipped with 300mm wafer processing capabilities in the first phase. This facility will serve as a valuable resource for small businesses, enabling them to develop, test, and refine their technologies in a production-like environment.
"The Yongin Cluster will serve as the cornerstone of SK Hynix's long-term growth strategy, fostering innovation and collaboration with our partners," stated Kim Young-sik, Vice President of Manufacturing Technology at SK Hynix. This visionary initiative underscores the company's dedication to driving progress and achieving mutual success within the semiconductor industry.
As SK Hynix embarks on this transformative journey, industry experts are closely monitoring developments in semiconductor technology. JEDEC, the leading semiconductor engineering standardization organization, is finalizing the HBM4 standard, which is expected to set new benchmarks for memory performance and efficiency. Meanwhile, recent reports suggesting that HBM chips failed tests conducted by Nvidia have been refuted by Samsung, another major player in the semiconductor market. Additionally, the concept of selector-only memory is gaining traction among industry advocates, with SK Hynix actively participating in advancing this innovative approach to memory design.