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Transphorm and Weltrend Collaborate on GaN System-in-Packages

April 24, 2024

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Transphorm has partnered with Weltrend Semiconductor to develop a new series of GaN System-in-Packages (SiPs) aimed at simplifying USB PD power delivery designs. The latest additions to this lineup are the WT7162RHUG24B and WT7162RHUG24C SIPs, which combine Weltrend's high frequency multi-mode Flyback PWM controller with Transphorm's SuperGaN FETs.

Building upon the success of a 240mΩ SiP introduced last year, these new SiPs are optimized for low-profile USB-C power adapters commonly used in mobile and IoT devices like smartphones, tablets, laptops, headphones, drones, speakers, and cameras. By integrating the FET and controller into a single package, developers can streamline their designs and enhance features for a variety of applications.

When paired with USB PD or programmable power adapter controllers, the SiPs offer a comprehensive adapter design solution with advanced features such as UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control. This enables faster development of high-quality power supplies with fewer components, following a straightforward design approach.

Wayne Lo, Vice President of Marketing at Weltrend, highlighted the significance of this collaboration, stating, "We're expanding our product offerings to cater to a wider range of power levels, from 30W USB-C PD adapters to nearly 200W chargers. The partnership with Transphorm allows us to deliver design simplicity and exceptional performance, showcasing the unique capabilities of Transphorm's GaN technology."

One of the key advantages of Transphorm's SuperGaN platform is its robustness and reliability, offering a gate margin of +/- 20 V with noise immunity of 4 V and a FIT rate of less than 0.05. This platform enables a 50% increase in power density compared to traditional silicon solutions. Weltrend's innovative SiP designs leverage these benefits to create a user-friendly solution that accelerates design processes and reduces form factor size.

Tushar Dhayagude, Vice President of Worldwide Sales and FAE at Transphorm, emphasized the importance of SiPs for adapter and charger manufacturers, stating, "These systems demand efficient power conversion with integrated functionality to simplify design processes and minimize learning curves. The new SiPs released by Transphorm and Weltrend underscore our commitment to providing customers with versatile solutions that meet their evolving needs."

The WT7162RHUG24B and WT7162RHUG24C SiPs are currently available for sampling, offering a glimpse into the future of USB PD power delivery solutions.

For more information, visit www.transphorm.com and www.weltrend.com.tw.

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