TSMC unveils integrated voltage regulator for AI

TSMC has unveiled an innovative Integrated Voltage Regulator (IVR) tailored for AI applications, boasting an impressive five times the vertical power density delivery compared to a traditional discrete design. This breakthrough comes at a crucial time as the latest AI datacentre chips demand currents of up to 1000A, with future generations expected to require even higher levels, potentially reaching 2000A or kilowatts of power. To meet these escalating power requirements, vertical power delivery has emerged as a key solution, enabling power to be efficiently fed into the back of the AI chip.

The IVR developed by TSMC leverages a power management IC (PMIC) constructed using a cutting-edge 16nm process technology. This PMIC integrates an ultra-thin inductor of either 2.5nH or 5nH, incorporating through silicon vias (TSVs) for enhanced performance. The design also incorporates ceramic layers to form the inductor, with the PMIC positioned on a substrate alongside an embedded deep trench capacitor (eDTC) within the interposer layer, utilizing the TSMC CoWoS-L process.

• TSMC provides insights into the A14 process, with support from Synopsys and Cadence
• Synopsys and TSMC explore backside power solutions for 16A

Within the voltage regulator, the eDTCs play a critical role by offering 1100 to 2500nF for power filtering, while the TSVs establish the connection between the printed circuit board and the backside power pads available in the advanced 1.6nm A16 process technology. Managing the kilowatt-level power output necessitates meticulous thermal modeling, a task facilitated by tools from EDA firms like Synopsys, Ansys, and Cadence Design Systems.

Despite the remarkable advancements, TSMC has not officially disclosed whether the PMIC was internally developed or created in collaboration with a partner. Regardless, the integration of the voltage regulator poses a significant challenge, underscoring the complexity of this cutting-edge technology. As a pure-play foundry, TSMC maintains a commitment to supporting its chip design customers and refrains from endorsing specific third-party chips. However, the emergence of this high-performance power chip design may signal its availability through the TSMC partnership ecosystem, potentially inspiring other PMIC designers to pursue similar innovations.