The Texas Institute for Electronics (TIE) at The University of Texas at Austin has secured an $840 million contract from the US DARPA research agency to develop high-performance chiplets for the Department of Defense. Over the next five years, TIE will establish an open access R&D and prototyping fabrication facility for chiplets used in radar, satellite imaging, unmanned aerial vehicles, and other defense systems.
Strategic partners in the DARPA project include industry giants such as AMD, Intel, and Micron, along with equipment and material suppliers like Applied Materials, Canon, and Resonac. Defense prime Raytheon is also part of the collaboration, aiming to advance chiplet technology for critical defense applications.
The program is divided into two phases, each lasting 2.5 years. In Phase 1, TIE will set up the infrastructure and basic capabilities for chiplet development. Phase 2 will focus on engineering 3DHI hardware prototypes crucial to the Department of Defense, automating processes, and addressing design challenges funded separately by DARPA.
According to John Schreck, CEO of TIE, “DARPA’s vision for the program includes developing an infrastructure that enables users to efficiently develop advanced microsystems meeting the defense industry’s stringent quality and reliability standards. This includes design collateral, EDA tools supporting three-dimensional constructs, and emerging capabilities like digital twins.”
The total investment in the project amounts to $1.4 billion, with $552 million contributed by the local Texas government for two UT fabrication facilities, including chiplets. These facilities will be accessible to industry, academia, and government entities, fostering dual-use innovations that benefit both the defense sector and the semiconductor industry.
Kevin Eltife, chairman of the UT System Board of Regents, expressed gratitude for the partnership, stating, “The University of Texas is honored to use our vast talent and expertise in service to our country. This collaboration will enable UT Austin to bolster national defense efforts and showcase the University’s global leadership in technology-related teaching and research.”
S.V. Sreenivasan, TIE founder and chief technology officer, highlighted the institute's commitment to building a team of semiconductor experts from the Cockrell School of Engineering and beyond to establish a national center of excellence in 3DHI microsystems. With the hiring of industry veteran John Schreck as CEO, TIE is investing in workforce development across Texas to create a talent ecosystem that can support its future endeavors.