U.S. and Australian cybersecurity agencies, in collaboration with international partners, have unveiled new secure AI integration principles for operational technology (OT) to assist operators in safely adopting artificial intelligence in critical-infrastructure settings. The guidance is centered on striking a balance between innovation...
Infineon Technologies has introduced SECORA Pay M, a platform that combines EMV payment and FIDO authentication on a single Java Card-based secure element for cards and contactless devices. Positioned against a backdrop of rising digital fraud, SECORA Pay M is intended to...
ROHM has recently announced the expansion of its wide-bandgap portfolio with the introduction of the SCT40xxDLL SiC MOSFET series in a compact TOLL (TO-Leadless) package. These new devices offer enhanced thermal characteristics and higher voltage capability in a slimmer footprint, making them...
e-peas has recently unveiled the AEM15820, a cutting-edge energy-harvesting PMIC specifically engineered to maximize power extraction from modern hybrid photovoltaic (PV) cells. These innovative hybrid devices are capable of harnessing energy from both indoor and outdoor light sources, generating a wide range...
The European Semiconductor Industry Association (ESIA) is urging the European Commission to significantly strengthen the upcoming revision of the EU Chips Act, calling for a more ambitious, industry-driven framework that can anchor Europe’s semiconductor strategy for the next decade. The appeal follows...
The World Semiconductor Trade Statistics (WSTS) organization has raised its outlook for 2025 and reaffirmed a strong growth trajectory through 2026, pushing the global chip market closer to the USD 1 trillion mark. The European Semiconductor Industry Association (ESIA) released the updated...
The global race to develop and deploy quantum-ready materials is accelerating rapidly, with new data projecting the quantum materials market to soar from $10.42 billion in 2024 to $96.9 billion by 2032. Driven by breakthroughs in quantum computing hardware, next-generation semiconductors, and...
The European Union and Singapore have strengthened their digital relationship following the second Digital Partnership Council meeting in Brussels. The meeting outlined plans covering various areas such as AI, data, cybersecurity, semiconductors, and digital trade. The discussions emphasized the shared goal of...
The global data center cooling sector is experiencing a significant period of growth as operators worldwide strive to support AI, high-performance computing (HPC), cloud platforms, and distributed architectures. Market data suggests that the industry is poised to expand from $21.86 billion in...
STMicroelectronics has unveiled the ST25DA-C, a secure NFC Forum Type 4 tag specifically designed for the Matter 1.5 tap-to-pair onboarding process. This innovative chip is the first of its kind, tailored for the updated standard to simplify the installation of various smart-home...