Under-bump metallization (UBM)

Under-bump metallization (UBM) is a critical aspect of the functionality of Semiconductor devices, forming the crucial connections between integrated circuits and the outside world. This intricate process plays a vital role in ensuring that electronic components operate with precision, particularly in the context of the ever-shrinking size of devices and increasing demands for performance. In this article, we will delve into the technicalities of under-bump metallization, exploring its structure, components, and the methods by which it is implemented.