Avicena and TSMC Collaborate on Photodetector Arrays for I/O Interconnects

Avicena has announced a collaboration with TSMC to enhance the performance of photodetector (PD) arrays for Avicena’s groundbreaking LightBundle microLED-based interconnects. These LightBundle interconnects are designed to support a shoreline density of over 1-Tbps/mm and extend ultra-high-density die-to-die (D2D) connections to distances exceeding 10 meters, all while achieving exceptional sub-pJ/bit energy efficiency. This advancement will enable AI scale-up networks to accommodate large clusters of GPUs across multiple racks, overcoming the reach limitations of current copper interconnects and significantly reducing power consumption.

The increasing complexity of AI models has led to a surge in demand for enhanced compute and memory performance, necessitating interconnect solutions with higher density, lower power consumption, and extended reach for both processor-to-processor (P2P) and processor-to-memory (P2M) connectivity. LightBundle has been specifically developed to meet the extreme I/O requirements of AI clusters, featuring incredibly high shoreline densities and ultra-low power consumption. The transmitters in LightBundle utilize microLED arrays that are optimized for dense, high-speed interconnects, achieving energy efficiency of less than 1-pJ/bit. The optical receivers in the system make use of silicon PD arrays that are tailored for the visible light wavelengths emitted by the microLEDs.

LightBundle chiplet transceivers are versatile and can be integrated into various packaging architectures, including co-packaged optics (CPO), onboard optics (OBO), and pluggable optical modules. Both the LED and PD arrays are directly bonded to the surface of CMOS ICs across a range of process nodes. This collaboration leverages TSMC’s expertise in image and optic sensor technologies to develop high-performance PD arrays optimized for visible light, while also benefiting from TSMC’s renowned manufacturing capabilities.

“Our partnership with TSMC dates back to the inception of Avicena. TSMC’s exceptional manufacturing capabilities and extensive experience in silicon optical sensors play a crucial role in the development and production of key components for our LightBundle interconnects,” stated Bardia Pezeshki, the co-founder and CEO of Avicena. The collaboration between Avicena and TSMC is aimed at advancing AI infrastructure to meet the escalating demands for compute scalability through efficient connectivity. Lucas Tsai, Vice President of Business Management at TSMC North America, emphasized TSMC’s commitment to providing a comprehensive portfolio of foundry CMOS image sensor (CIS) technologies to support innovative initiatives like Avicena’s LightBundle project.