Cost-Effective Manufacturing Method for Chiplet Development

The semiconductor industry is constantly evolving, with new technologies emerging to meet the demands of higher-performance chips. One such innovation is the Shin-Etsu dual damascene method, which is revolutionizing the package substrate manufacturing process. This method utilizes high-performance processing equipment, including an excimer laser, to directly form an interposer's functions into a package substrate. By eliminating the need for an interposer, this approach enables further microfabrication that traditional methods cannot achieve.

Chiplet technology, where circuits are singulated and assembled in a package, has the potential to reduce manufacturing costs for advanced semiconductors. Typically, an interposer is used to mount multiple chiplets and connect them. However, with the Shin-Etsu dual damascene method, the interposer becomes unnecessary. Instead, chiplets are connected directly to a package substrate using wiring patterns, streamlining the assembly process and reducing costs significantly.

The sophisticated microfabrication technology of the equipment allows complex electric circuit patterns to be formed directly in the organic insulation layers of a multi-layered package substrate. By utilizing an excimer laser for large-area circuit pattern formation, the method enables further miniaturization of microfabrication processes. This advancement surpasses traditional semi-additive processing methods, leading to more efficient and cost-effective manufacturing.

With the Shin-Etsu dual damascene method, processing large areas of package substrates is made possible through the use of specialized equipment. The laser processing equipment can handle areas of 100 mm square or larger at once, significantly improving efficiency. Processing time varies based on substrate size, but the method ensures consistent processing times for wiring patterns, electrode pads, and vias. This level of precision and speed is crucial for meeting the demands of modern semiconductor manufacturing.

Shin-Etsu Chemical is at the forefront of developing integrated solutions for semiconductor manufacturing. By combining material and equipment technologies, the company aims to lead the way in next-generation chiplet development. Through ongoing research and development, Shin-Etsu Chemical is driving innovation in the industry and contributing to cost reduction efforts. For more information, visit www.shinetsu.co.jp.