Cutting-Edge X-Ray Upgrade Reveals Transistors in 3D

An upgraded X-ray imaging technique is revolutionizing the way we view the inner workings of computer chips. This cutting-edge method provides crisp, 3D images of chips, allowing us to see their intricate designs and detect any flaws they may have. With an impressive resolution of 4 nanometers, the images produced are clear enough to map a chip’s wiring paths and reveal tiny transistor features without causing any damage to the chip.

A team of brilliant scientists at the Paul Scherrer Institute, led by Tomas Aidukas and Mirko Holler, collaborated with experts from the University of Southern California and ETH Zürich to develop this groundbreaking imaging technique. Building upon their previous work with ptychographic X-ray laminography (PyXL), the team aimed to provide a non-destructive alternative to the time-consuming quality control processes traditionally used to inspect chip designs.

According to Baohua Niu, a principle engineer at the Intel Foundry in Hillsboro, Oregon, the complexity of modern chips makes it challenging to identify defects using conventional methods. Electrical tests alone are often insufficient, prompting engineers to rely on a combination of optical imaging and other techniques to pinpoint potential issues. By utilizing scanning electron microscopy and transmission electron microscopy, engineers can locate flaws and make necessary design corrections.

The new imaging technique harnesses the power of "hard" or high-energy X-rays generated at a synchrotron particle accelerator. These intense beams can penetrate through the entire chip without the need for slicing, offering a comprehensive view of the chip's internal structure. By illuminating the sample from various angles with a coherent beam of high-energy X-rays, tiny features within the chip diffract the light, enabling algorithms to reconstruct a detailed image based on the diffracted X-rays' intensity and phase. This advanced imaging approach, known as ptychography, represents a significant leap forward in chip inspection technology.

With this innovative X-ray imaging technique, scientists and engineers now have a powerful tool at their disposal to analyze and understand the intricate designs of computer chips with unprecedented clarity and precision. By providing non-destructive imaging capabilities at the nanometer scale, this method is poised to revolutionize the field of chip manufacturing and quality control, paving the way for more efficient and reliable electronic devices in the future.