Cutting Power Usage with Low-Power Cryogenic Memory

As the demand for more powerful server chips and AI processors continues to rise, data centers are facing significant challenges in terms of power consumption and cooling requirements. In an effort to address these issues, sureCore has introduced a groundbreaking solution by integrating low power cryogenic memory into their systems. This innovative approach not only reduces SRAM power dissipation but also has the potential to make data centers more energy-efficient by decreasing the overall cooling load.

The power consumption of data centers has become a pressing concern, especially with the growing adoption of AI technologies such as Large Language Models. Studies have indicated that cooling power-hungry processing chips to extremely low temperatures, such as liquid nitrogen levels at around 77K, can result in a substantial reduction in power usage. However, a significant portion of this advantage is often offset by cooling costs. Nevertheless, the prospect of achieving a four-fold reduction in power consumption has captured the attention of the industry.

Paul Wells, the CEO of sureCore, highlighted the company's collaboration with Semiwise in developing cryogenic transistor SPICE models as part of an InnovateUK funded project. By optimizing their low power memory technology to operate at temperatures as low as 4K, sureCore aims not only to create memory solutions for cryogenic environments but also to minimize thermal load within data centers. This strategic approach could potentially lead to a 50% reduction in memory power consumption, thereby offering significant benefits in terms of thermal dissipation and cooling power efficiency.

Professor Asen Asenov, CEO of SemiWise, emphasized the importance of accurate cryogenic transistor SPICE models in driving the AI revolution forward. These models enable IP developers to create advanced IP suites for SoC developers, paving the way for the next generation of AI server chips. SemiWise's innovative technology in engineering PDK-strength cryogenic SPICE models, based on a combination of cryogenic measurements and TCAD simulations, is poised to play a crucial role in shaping the future of AI computing.

sureCore's expertise in ultra-low power memory design has led to the development of embedded Static Random Access Memory (SRAM) capable of operating at extreme temperatures ranging from 77K down to near absolute zero, as required by Quantum Computers (QCs). By re-characterizing standard cell and IO cell libraries for cryogenic operation, sureCore has streamlined the adoption of an industry-standard physical design flow. The CryoMem range of IP, part of an Innovate UK project led by sureCore, is set to undergo evaluation at cryogenic temperatures through test chips, marking a significant milestone in the advancement of cryogenic memory technology.

In conclusion, Paul Wells expressed optimism about the potential of sureCore's ultra-low power memory technologies to address the heat challenges faced by data centers. By offering a viable solution to enhance energy efficiency and reduce cooling requirements, sureCore is poised to make a lasting impact on the future of data center infrastructure.