Dense Designs Benefit from PAM4 Signal Delivery via Cable Assemblies

High-speed connectivity is crucial in various industries, and NovaRay cable assemblies are at the forefront of enabling cutting-edge applications. These cable assemblies find applications in datacom, AI/ML, HPC, computer and semiconductor, medical, test and measurement, military/aerospace, and mobile networks. With their exceptional performance capabilities, NovaRay cable assemblies are revolutionizing the way data is transmitted across different systems.

The NovaRay cable assemblies stand out for their ability to deliver extremely low crosstalk (<30 dB, FEXT and NEXT) out to 40 GHz. Operating efficiently across a wide temperature range of -40 to +125˚C, these cable assemblies (part number NVAC) are PCIe®6.0/CXL® 3.1 capable, making them ideal for high-speed data transmission requirements in demanding environments.

The innovative design of the NovaRay connector sets it apart from traditional connectors. It combines extreme performance with extreme density, a critical feature as speeds increase and system sizes decrease. The fully shielded differential pair design and two reliable points of contact contribute to an industry-leading 4.0 Tbps aggregate data rate. Additionally, the NovaRay cable assemblies come with two connectors and offer optional shielding and latching systems for enhanced versatility.

In the realm of development, the NovaRay® Micro Rugged Backplane system is designed to support blind mate applications with optional guidance and keying, along with standard weld tabs for a secure connection to the board. This ultra-high density design allows for up to 128 differential pairs in a single connector, providing designers with unparalleled flexibility in signal routing. The NovaRay® wafer design ensures optimal performance up to 112 Gbps PAM4, eliminating intra-pair skew and resonances for seamless data transmission.

For applications requiring improved signal integrity and routability, the ExaMAX® backplane cable systems offer a solution using Samtec Flyover® technology. By routing the signal above a lossy PCB using co-extruded, ultra-low skew twinax, these systems enhance bandwidth and reach. Direct solder attach to contacts optimizes the signal path, further boosting performance and supporting 112 Gbps PAM4 applications, in addition to being PCIe® 6.0/CXL® 3.1 capable.