Infineon and MediaTek Collaborate on Android Smart Cockpit

Infineon Technologies has partnered with MediaTek and its design house partners to develop an innovative Android-based smart cockpit design. This design is built on the Traveo microcontroller and an entry-level Dimensity Auto SoC, combining cutting-edge technology to enhance the automotive user experience.

The reference design integrates the Mediatek Auto chip running Android with the Infineon Traveo CYT4DN microcontroller, which serves as the safety companion to meet the ASIL-B specification. In case of errors, the Traveo microcontroller takes over with reduced functionality, ensuring the safety and reliability of the system while maintaining communication with the vehicle network.

With a resolution of 1920 x 720 pixels for clusters and in-vehicle infotainment displays, the design aligns with the industry trend towards digital cockpits. This shift away from traditional buttons and controls towards advanced displays reflects the evolving needs of modern vehicle users.

The digital cockpit system plays a crucial role in delivering high-performance features to vehicle users while meeting functional safety targets. Typically, achieving these goals would involve running the system on a high-performance SoC with a hypervisor, leading to significant upfront investments and ongoing license fees.

By utilizing the Traveo microcontroller in combination with the Dimensity SoC running on the open-source Android operating system, the system cost is significantly reduced. This approach eliminates the need for a hypervisor and expensive commercial operating systems, making it a cost-effective solution for mid- to low-end car models.

“Our automotive SoC, combined with Infineon’s Traveo T2G MCU, will provide a cost-effective cockpit solution that delivers new possibilities to OEMs and Tier 1 companies,” said Xiong Jian, vice general manager of the Automotive product line at MediaTek. This collaboration aims to enhance the performance and capabilities of the cockpit in entry-level car models.

“A modern cockpit supports the driver and increases driving comfort for all vehicle occupants. That is why it is important to us that cost-optimized vehicle models can also be equipped with digital solutions,” said Ralf Koedel, Vice President Microcontroller Smart Mobility at Infineon. The Traveo T2G CYT4DN MCU offers a secure computing platform with low-power flash memory and high-performance peripherals.

Manufactured on an advanced 40nm process, the Traveo MCU family features a 2.5D graphics engine, multiple ARM Cortex-M7 CPUs, and embedded peripherals supporting various communication interfaces. With memory options tailored for optimal performance, the Traveo T2G CYT4DN family is designed to meet the evolving demands of digital cockpits in the automotive industry.