July’s Top Stories on eeNews Europe

July was a month filled with significant AI acquisitions in Europe, showcasing the region's growing importance in the tech industry. AMD made a bold move by acquiring Silo.ai, Europe's largest private AI lab, for a substantial $665 million. This strategic purchase underlines AMD's commitment to expanding its AI capabilities and presence in the European market.

Meanwhile, Softbank confirmed its acquisition of UK-based AI chip design company, Graphcore, in a deal estimated to be around $400 million. Despite being less than the total funding raised by Graphcore in recent years, this acquisition provides Softbank with a valuable chip business and strengthens its partnerships, including with TSMC and its ownership of ARM.

Notable advancements in AI technology were also seen in the development of an ARM microcontroller system for edge AI, complemented by a sparse AI accelerator from Femtosense. Additionally, MikroE introduced a streamlined path for its Click boards, facilitating a smooth transition from prototyping to production, enhancing efficiency in the development process.

The Dutch industry made waves with its rallying cry of 'No Chips, No Glory,' aiming to bolster the supply chain through a funding bid under the EU Chips Act. This initiative coincided with the re-election of the president of the Commission for a second term, signaling a strong commitment to technological innovation and growth in the region.

As wildfires continue to pose a threat globally, researchers leveraged a physics-based AI framework to predict the trajectory of fires, potentially saving lives through early detection and intervention. In parallel, the advancement of a more precise atomic clock promises enhanced navigation systems, while Microchip's expansion into the 64-bit market marks a significant milestone in the tech industry.

However, the spotlight of the month was on the development of sub-1nm transistor technology, a groundbreaking achievement by researchers in Korea. By creating one-dimensional metallic layers as small as 0.4nm, these advancements pave the way for cutting-edge process technologies expected to shape the future beyond 2035, revolutionizing the landscape of semiconductor innovation.