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GaN boost from PCB packaged power project

GaN boost from PCB packaged power project

A project in the UK is developing packaged power functions such as a half bridge with pre-packaged gallium nitride (GaN) devices for lower cost, weight and size. The Pre-packaged Power devices for PCB Embedded Power (P3EP) project has been developing capabilities to support...

Published on: November 29, 2024

Lime taps CM5 for 5G basestation in a box MIMO

Lime taps CM5 for 5G basestation in a box MIMO

Lime Microsystems in the UK is using the latest Compute Module 5 (CM5) from Raspberry Pi to boost the performance of its 5G basestation in a boxThe LimeNET Micro 2.0 board is being upgraded from CM4 to the long awaited CM5, launched...

Published on: November 29, 2024

CEO interview: Charge-based in memory compute at Encharge AI

CEO interview: Charge-based in memory compute at Encharge AI

Naveen Verma, CEO of encharge.ai talks to eeNews Europe about its analog in memory compute technology for edge AI.US startup Encharge AI is reaching the next stage of its development of in-memory compute (IMC) for low power AI. The company has raised...

Published on: November 29, 2024

Magnetic digital encoder has mounting flexibility

Magnetic digital encoder has mounting flexibility

Melexis has launched an absolute magnetic encoder IC with mounting flexibility for micro-motors.The MLX90382 magnetic position sensor combines a Hall magnetic front end, a 14bit analog-to-digital converter, on-chip digital signal processing with zero latency, and multiple output drivers. Differential outputs and a speed...

Published on: November 28, 2024

Hightec, Andes team for ASIL-D RISC-V compiler

Hightec, Andes team for ASIL-D RISC-V compiler

HighTec EDV-Systeme in Germany is supporting the Andes’ RISC-V IP in its highly optimized ASIL-D C/C++ compiler for the automotive market.HighTec’s compiler now supports the Andes’ functional safety certified RISC-V cores to ensure optimized code generation for automotive processors, improving efficiency and...

Published on: November 28, 2024

Molex offers 10 predictions for high-speed connectivity in 2025

Molex offers 10 predictions for high-speed connectivity in 2025

Molex is predicting an uptick in reliable, durable, high-speed interconnects over the next 12-to-18 months as the impact of generative artificial intelligence, machine learning and cloud developments and implementation intensifies across every sector, including data centers, automotive, consumer electronics and medical technology....

Published on: November 28, 2024

Report: CSPs target value delivery rather than data volume with 5G

Report: CSPs target value delivery rather than data volume with 5G

The November 2024 Ericsson mobility report finds the 5G SA (Standalone) and Advanced are expected to be key focuses for communications service providers (CSPs) for the remainder of the decade as they deploy new capabilities to create offerings centered on value delivery...

Published on: November 28, 2024

TTA signs agreement to adopt O-RAN standards for mobile networks

TTA signs agreement to adopt O-RAN standards for mobile networks

To advance open mobile networks. TTA and O-RAN ALLIANCE have officially announced the signing of an agreement that enables the adoption of O-RAN ALLIANCE specifications to TTA standards.The agreement establishes a collaborative process through which individual O-RAN specifications will be selected and adopted...

Published on: November 28, 2024

Huawei uses AI to improve network operation and maintenance

Huawei uses AI to improve network operation and maintenance

With the advent of new radio access technologies (RATs), the core network structure has become increasingly complex, posing significant challenges to network organisation and maintenance (O&M). To address this, Huawei has taken the lead in developing ICNMaster, the industry’s first intelligent core...

Published on: November 28, 2024

Molex offers 10 predictions for high-speed connectivity in 2025,

Molex offers 10 predictions for high-speed connectivity in 2025,

Molex is predicting an uptick in reliable, durable, high-speed interconnects over the next 12-to-18 months as the impact of generative artificial intelligence, machine learning and cloud developments and implementation intensifies across every sector, including data centers, automotive, consumer electronics and medical technology....

Published on: November 28, 2024

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