Rapidus Partners with Seiko Epson for Chiplet Cleanroom Project

Rapidus, a leading semiconductor technology company, is making significant strides in advancing its research and development capabilities by setting up a state-of-the-art clean room at Seiko Epson in Japan. The new facility, known as the Rapidus Chiplet Solutions (RCS) R&D facility, will be situated on Seiko Epson's Chitose campus and is expected to be operational by 2026. This strategic move underscores Rapidus' commitment to enhancing its back-end semiconductor manufacturing processes.

The clean room, spanning an impressive area of approximately 9,000m2 (96,875 square feet), will serve as a hub for Rapidus to focus on developing mass production technologies for chiplet packages. Collaborating closely with industry partners such as IBM on the 2nm front-end process technology, Rapidus aims to further expand its expertise in chiplet technologies. The company's dedication to innovation and cutting-edge solutions is evident in its continuous efforts to push the boundaries of semiconductor manufacturing.

With plans to commence the installation of manufacturing equipment in April 2025, Rapidus is on track to kickstart its R&D activities at the RCS facility in April 2026. The facility will house pilot lines dedicated to key processes such as FCBGA, Si interposer, RDL, and hybrid bonding, in addition to conducting essential research on mass production technologies and equipment automation. This meticulous approach underscores Rapidus' meticulous attention to detail and commitment to excellence in semiconductor manufacturing.

Japan's Ministry of Economy, Trade and Industry (MITI) and the New Energy and Industrial Technology Development Organization (NEDO) have given their stamp of approval to Rapidus' ambitious project for the "Development of Chiplet Package Design and Manufacturing Technology for 2nm Generation Semiconductors." The project, initiated in April 2024, focuses on core technologies such as chiplet integration and 2.5D/3D packaging, signaling a significant step forward in semiconductor research and development.

Rapidus' collaborative efforts extend beyond borders, with partnerships established with esteemed organizations across four countries. Working closely with entities such as LSTC, AIST, the University of Tokyo, Fraunhofer in Germany, and A*STAR IME in Singapore, Rapidus is at the forefront of driving packaging advancements in the semiconductor industry. By leveraging a global network of expertise, Rapidus is poised to revolutionize semiconductor manufacturing and pave the way for future technological innovations.