Revolutionizing Chip Design with Coreless Organic Interposer Technology

Toppan, a leading semiconductor technology company, has recently unveiled a groundbreaking innovation in the field of semiconductor packaging. The company has developed a high-reliability coreless organic interposer designed specifically for next-generation semiconductors, including chiplet designs.

The coreless organic interposer utilizes a material with a low coefficient of thermal expansion (CTE) to reinforce both sides of the redistribution layer (RDL), providing enhanced rigidity for electrical testing purposes. This innovative approach ensures the reliability and durability of the interposer, crucial for the seamless functioning of advanced semiconductor devices.

Unlike traditional packaging substrates, the organic interposer features a simple coreless structure with both sides of the RDL reinforced by a low CTE material. This design not only supports fine pitch interconnections but also offers a significantly lower thermal expansion rate, essential for maintaining stable and reliable interconnectivity.

With a CTE that is approximately 45% lower than conventional substrates, the coreless organic interposer effectively mitigates the risk of cracks caused by CTE mismatches between different components. This breakthrough allows for independent operation of the interposer, enabling standalone electrical inspection and minimizing the financial losses associated with defective chips and chiplets.

In a strategic move, Toppan has decided to spin out its semiconductor mask business ahead of an upcoming IPO, signaling its commitment to focusing on cutting-edge semiconductor technologies and solutions.

Heterogeneous integration, a key trend in the semiconductor industry, involves integrating multiple types of chips on an interposer to enhance overall performance. While silicon interposers have been dominant, the adoption of organic interposers is expected to grow in the future due to cost considerations.

However, traditional organic interposers have been plagued by poor structural rigidity, making standalone handling challenging. By separating the interposer from the carrier during manufacturing, Toppan's coreless organic interposer enables standalone electrical inspection, improving reliability and facilitating supply as a known-good substrate.

The innovative narrow pitch mold resin through-mold via (TMV) structure allows for fine routing and interconnection, with minimal connection terminal pitches of 40μm on the chip side and 130μm on the substrate side. This advancement opens up new possibilities for high-density semiconductor packaging.

Toppan's organic interposer leverages the scalability of panel-level manufacturing, supporting large sizes exceeding 100 mm sq. This scalability, combined with the enhanced reliability and performance of the coreless structure, positions the product as an ideal solution for applications such as data center CPUs and AI accelerators.

Interested parties can expect samples of next-generation semiconductor-packaging-related products, featuring Toppan's innovative coreless organic interposer, to be available starting in 2027, with mass production slated for 2028. For more information, visit Toppan's official website.