Synopsys Applauds US Progress on Digital Twin and Chip R&D

The US Chips Act is entering its second year with a renewed focus on research and development, aiming to propel the semiconductor industry forward with innovations such as digital twins and chiplets.

According to Dustin Todd, Vice President of Government Affairs at Synopsys, the CHIPS and Science Act has reached a significant milestone. Todd stated, “Today marks the second anniversary of the United States’ landmark CHIPS and Science Act. The next chapter of the CHIPS Act is underway to allocate a substantial $13 billion in CHIPS research and development (R&D) funds, shaping the future of the US as an innovation hub in the global semiconductor industry.”

As the industry progresses with manufacturing projects, there is a growing recognition of the importance of investing in research and development to support semiconductor fabrication. Synopsys CEO Sassine Ghazi emphasized, “R&D is the lifeblood of the semiconductor industry, and investments in this area will drive significant advancements to address design and manufacturing complexities, while nurturing the next generation of innovators.”

The R&D funding, sourced from various US government entities including the Department of Defense and the Microelectronic Commons, is set to establish the National Semiconductor Technology Centre (NSTC) and a five-year microelectronics strategy. This initiative aims to bolster the semiconductor ecosystem and drive innovation in the sector.

One of the key areas of focus for the CHIPS Act is the development of modular, chiplet-based designs that have the potential to enable trillion-transistor systems. Synopsys has introduced tools like the 3DIC Compiler and 3DSO.ai software, which are poised to play a crucial role in the CHIPS Manufacturing USA Institute. These tools are expected to revolutionize the manufacturing process and enhance collaboration between chipmakers and systems companies.

Furthermore, the establishment of the CHIPS Digital Twin Manufacturing USA Institute under the CHIPS National Advanced Packaging Manufacturing Program (NAPMP) is seen as a significant step towards advancing semiconductor manufacturing capabilities. This institute is set to drive innovations that will benefit the industry as a whole, paving the way for cutting-edge developments in chip manufacturing.