TSMC to Introduce Automotive Chiplet Process by 2025

TSMC, the leading semiconductor foundry, has announced its plans to introduce automotive qualified versions of its innovative 3D fabric chiplet technology by the end of 2025. This development marks a significant step forward in the company's efforts to cater to the specific needs of the automotive industry.

The InFO-oS fanout technology, which enables the support of multiple SoC devices on a substrate, is set to play a crucial role in this initiative. TSMC aims to release the first automotive chiplet process design kit (PDK) by the end of this year, with the full PDK expected to be available early in 2026.

Moreover, the CoWoS-R process, designed to support SOCs with high-performance HBM memory via an interposer to the substrate, is another key aspect of TSMC's automotive chiplet technology roadmap. The initial PDK for this process will be launched shortly, followed by the full PDK in early 2026.

According to TSMC, these cutting-edge processes will be AEC Q100 Grade2 qualified by Q4 2025, underscoring the company's commitment to meeting the stringent quality standards of the automotive industry. The announcement was made during TSMC's European technology symposium, where the company highlighted its focus on driving innovation in the automotive sector.

Furthermore, TSMC's CoWoS platform, which includes the well-established Si interposer-based CoWoS-S and the organic interposer-based CoWoS-L and R, serves as the foundation for the automotive chiplet technology. With a wealth of experience from over 150 CoWoS customer product tapeouts for more than 25 clients expected by the end of this year, TSMC is well-positioned to deliver cutting-edge solutions to the automotive market.

Looking ahead, automotive remains a key focus area for TSMC's joint venture fab, ESMC, which is slated to commence construction later this year and begin volume production in 2027. ESMC, a strategic collaboration involving Bosch, Infineon, NXP, and TSMC, aims to provide European customers with access to advanced N28 and N16 process technologies, further solidifying TSMC's commitment to driving innovation and growth in the automotive semiconductor sector.