Octavo Enhances SiP Integration with Doubled Package System

Octavo, a leading packaging pioneer, is on a mission to revolutionize its systems by combining two innovative technologies to enhance integration capabilities.

One of Octavo's recent developments involves the creation of two types of System-in-Package (SiP) solutions for the STM32MP2 processor, which features embedded artificial intelligence (AI). The first solution, known as OSD32MP2-PM (processor module), integrates the MP2 processor onto the DDR4 DRAM, boasting a compact footprint of 9 x 14mm. The second SiP variant utilizes the bare processor die and DRAM along with power management components, packaged in a slightly larger module measuring 21 x 21mm.

Looking ahead, Octavo is exploring the possibility of replacing the DRAM and processor die within the 21 x 21mm module with the MP SiP, thereby freeing up valuable space currently occupied by the ST processor. Erik Walsh, the Chief Technology Officer at Octavo, envisions leveraging this newfound space for integrating additional components such as a wireless chip or FPGA for power management purposes.

"It's a new architecture," Walsh explains. "The IC leaves a significant space, and we are actively exploring the potential applications for this available area."

While samples of the OSD32MP2-PM are slated to be available by the end of 2024, followed by the OSD32MP2 samples in early 2025, any further advancements in this domain are expected to occur post these timelines. Nevertheless, Octavo is keen on standardizing its packaging solutions based on the 21 x 21mm footprint, signaling a commitment to efficiency and consistency in its product offerings.

For more information on Octavo's cutting-edge packaging solutions and ongoing developments, visit www.octavo.com.